曾杰, 檀浩浩, 杨方, 周望君, 李亮星, 常桂钦, & 罗海辉. (2023). IGBT模块焊层的被动热循环可靠性分析. 焊接学报, 44(7), 123-128. https://doi.org/10.12073/j.hjxb.20220517002
Chicago Style (17th ed.) Citation曾杰, 檀浩浩, 杨方, 周望君, 李亮星, 常桂钦, and 罗海辉. "IGBT模块焊层的被动热循环可靠性分析." 焊接学报 44, no. 7 (2023): 123-128. https://doi.org/10.12073/j.hjxb.20220517002.
MLA (9th ed.) Citation曾杰, et al. "IGBT模块焊层的被动热循环可靠性分析." 焊接学报, vol. 44, no. 7, 2023, pp. 123-128, https://doi.org/10.12073/j.hjxb.20220517002.
Warning: These citations may not always be 100% accurate.