Ag-In复合焊膏的高温抗电化学迁移行为 - 张博雯; 王微; 冯浩男; 赵志远; 鲁鑫焱; 梅云辉 (焊接学报, 2023)
Keywords: 纳米银焊膏; packaging reliability; 封装互连可靠性; electrochemical migration; anti-electromigration of Ag-In paste; nano-silver paste; 电化学迁移; 抗电迁移Ag-In焊膏