Piezocatalysis for Chemical–Mechanical Polishing of SiC: Dual Roles of t‐BaTiO3 as a Piezocatalyst and an Abrasive

• Published in: Small (Weinheim an der Bergstrasse, Germany) Vol. 20; no. 21; pp. e2310117 - n/a
• Main Authors: Hu, Tao, Feng, Jinxi, Yan, Wen, Tian, Shuanghong, Sun, Jingxiang, Liu, Xiaosheng, Wei, Di, Wang, Ziming, Yu, Yang, Lam, Jason Chun‐Ho, Liu, Shaorong, Wang, Zhong Lin, Xiong, Ya
• Format: Journal Article
• Language: English
• Published: Weinheim Wiley Subscription Services, Inc 01.05.2024
• Subjects: Activated sintering; Barium titanates; BaTiO3; Chemical-mechanical polishing; Clean energy; Density functional theory; Oxidation; Oxidizing agents; piezocatalytic‐CMP; Polishes; polishing; SiC; Silicon carbide; Silicon dioxide; Surface roughness

Chemical mechanical polishing (CMP) offers a promising pathway to smooth third‐generation semiconductors. However, it is still a challenge to reduce the use of additional oxidants or/and energy in current CMP processes. Here, a new and green atomically smoothing method: Piezocatalytic‐CMP (Piezo‐CMP...