The influence of post-bond heat treatment on microstructural development in martensite-forming NiAl-NiTi transient liquid phase bonds employing copper interlayers

• Published in: Journal of materials science Vol. 32; no. 10; pp. 2543 - 2547
• Main Authors: GALE, W. F, GUAN, Y
• Format: Journal Article
• Language: English
• Published: Heidelberg Springer 15.05.1997; Springer Nature B.V
• Subjects: Aluminum; Applied sciences; Bonding; Copper; Exact sciences and technology; Heat treating; Heat treatment; Interlayers; Intermetallic compounds; Joining, thermal cutting: metallurgical aspects; Liquid phases; Martensite; Martensitic transformations; Materials science; Metals. Metallurgy; Nickel aluminides; Nickel base alloys; Nickel compounds; Nickel titanides; Substrates; Titanium compounds; Transmission electron microscopy; Welding; Interfacial layer; Titanium alloy; Nickel base alloys; Heat treatment; Intermetallic compound; Joining; Aluminium alloy; Liquid phase; Precipitation; Post weld treatment; Chromium alloy; Interface reaction; Copper; Microstructure

An investigation is presented of the influence of post-bond heat treatment on microstructural development in transient liquid phase bonds between L10 martensite-forming Ni-24 at% Al-16 at% Cr and nominally stoichiometric NiTi which transforms to monoclinic (distorted B19 type) martensite. The joints...