TIME-DEPENDENT BEHAVIOUR OF PEN FOIL USED AS SUBSTRATE FOR LITHOGRAPHY-BASED FLEXIBLE ELECTRONICS

• Published in: AIP Conference Proceedings pp. 15 - 17
• Main Authors: Yakimets, I, Giesen, P, Goorhuis, M, Barink, M
• Format: Conference Proceeding
• Language: English
• Published: 21.09.2008
• ISBN: 9780735405707; 0735405700
• ISSN: 0094-243X
• DOI: 10.1063/1.2988985

Main objective of this research work is to accurately measure and predict in-plane micro-deformation and bending of foil-on-carrier during lamination and lithographic process. It was demonstrated that lamination of foil on carrier introduced (1) an average in-plane micro-expansion of e = 1819+/-262 ppm independently of foil orientation and (2) bending up to 300 mum, which was strongly related to the foil thickness. Besides this initial in-plane expansion introduced by lamination, the thermal steps of lithography process introduce additional micro-deformation to the foil. To be able to predict the micro-deformation and also time-dependent behaviour of foil-on-carrier, a multi-mode Maxwell model was employed. The parameters of this model were identified by fitting to the storage and loss moduli measured by DMTA. It was shown that: (1) the used high resolution measurement technique was able to measure in-plane micro-deformation of foil fixed on carrier; (2) a classical model for linear viscoelasticity was used to predict time-dependent behaviour of foil-fixed on carrier. Obtained experimental data and modelling approach were used to optimize the lithography process.