무연솔더 동판부식 시험법 연구

• Published in: Journal of welding and joining Vol. 35; no. 3; pp. 21 - 27
• Main Authors: 김미송(Mi-Song Kim), 홍원식(Won Sik Hong), 오철민(Chul Min Oh), 김근수(Keun-Soo Kim)
• Format: Journal Article
• Language: Korean
• Published: 대한용접·접합학회 2017; 대한용접접합학회
• Subjects: 기계공학; Solder; Test method; Lead-Free; Cu; Corrosion
• ISSN: 2466-2232; 2466-2100
• DOI: 10.5781/JWJ.2017.35.3.4

A soldering temperature of ($235{\pm}3$) $^{\circ}C$ is described in ISO 9455-15 for the copper corrosion test. However, this temperature is not suitable for performing lead-free solder pastes. We evaluated the compatibility of a lead-free solder paste in the experimental conditions of (Liquidus temperature + ($35{\pm}3$)) $^{\circ}C$. Based on the results after a Cu corrosion test, a proper temperature for Pb-free soldering was (melting point+($35{\pm}3$)) $^{\circ}C$. Criteria used to evaluate corrosion due to discoloration of flux residue is described in ISO 9455-15, but a more quantitative evaluation standard is needed. In this study, experimental error level was estimated by analyzing flux residue after a corrosion test for 72, 500 hours of specimens using EDS analysis with acceleration voltage. It was determined that the copper area at the flux residue boundary is suitable for the EDS analysis area.