탄화온도가 탄화보드의 열전도율 및 전기적 성질에 미치는 영향
탄화보드의 실용화를 위한 기초연구로 중밀도섬유판, 파티클보드, 합판 및 물푸레나무 목재를 400∼1,100°C로 탄화하여 탄화온도에 따른 열전도율 및 전기적 성질을 측정하였다. 열전도율은 탄화 파티클보드의 탄화온도가 900°C일 때 0.1326 m/k로 가장 우수하였으며, 전반적으로 탄화보드의 밀도가 클수록 열전도율이 빨랐다. 비저항값은 탄화온도가 높을수록 감소하여 탄화온도 1,000°C 이후에는 거의 도체에 가까운 값을 나타냈다. 높은 전압으로 탄화보드에 전기를 통했을 때 전류와 전력은 증가하였으며 표면온도가 높았다. This s...
Saved in:
Published in | 목재공학 Vol. 41; no. 1; pp. 58 - 63 |
---|---|
Main Authors | , , , , , , , |
Format | Journal Article |
Language | Korean |
Published |
한국목재공학회
01.01.2013
|
Subjects | |
Online Access | Get full text |
ISSN | 1017-0715 2233-7180 |
Cover
Loading…
Abstract | 탄화보드의 실용화를 위한 기초연구로 중밀도섬유판, 파티클보드, 합판 및 물푸레나무 목재를 400∼1,100°C로 탄화하여 탄화온도에 따른 열전도율 및 전기적 성질을 측정하였다. 열전도율은 탄화 파티클보드의 탄화온도가 900°C일 때 0.1326 m/k로 가장 우수하였으며, 전반적으로 탄화보드의 밀도가 클수록 열전도율이 빨랐다. 비저항값은 탄화온도가 높을수록 감소하여 탄화온도 1,000°C 이후에는 거의 도체에 가까운 값을 나타냈다. 높은 전압으로 탄화보드에 전기를 통했을 때 전류와 전력은 증가하였으며 표면온도가 높았다.
This study is a basic research for practical applications of carbonized boards, which measured thermal conductivity and electrical properties of carbonized boards manufactured at different carbonization temperature (400∼1,100°C) using a medium density fiberboard, particleboard, plywood and wood (Fraxinus rhynchophylla). The highest value of thermal conductivity was 0.1326 m/k at carbonization temperature of 900°C in the carbonized particleboard. Overall, the higher density of carbonized board, thermal conductivity was faster. As the electrical resistivity decreased with increased carbonization temperature, it was almost close to conductor after carbonization temperature of 1,000°C. When electricity has worked on the carbonized board by high voltage, the current and the electric power increased and surface temperature of carbonized board was high. |
---|---|
AbstractList | 탄화보드의 실용화를 위한 기초연구로 중밀도섬유판, 파티클보드, 합판 및 물푸레나무 목재를 400∼1,100°C로 탄화하여 탄화온도에 따른 열전도율 및 전기적 성질을 측정하였다. 열전도율은 탄화 파티클보드의 탄화온도가 900°C일 때 0.1326 m/k로 가장 우수하였으며, 전반적으로 탄화보드의 밀도가 클수록 열전도율이 빨랐다. 비저항값은 탄화온도가 높을수록 감소하여 탄화온도 1,000°C 이후에는 거의 도체에 가까운 값을 나타냈다. 높은 전압으로 탄화보드에 전기를 통했을 때 전류와 전력은 증가하였으며 표면온도가 높았다. This study is a basic research for practical applications of carbonized boards, which measuredthermal conductivity and electrical properties of carbonized boards manufactured at differentcarbonization temperature (400∼1,100°C) using a medium density fiberboard, particleboard,plywood and wood (Fraxinus rhynchophylla). The highest value of thermal conductivity was0.1326 m/k at carbonization temperature of 900°C in the carbonized particleboard. Overall, thehigher density of carbonized board, thermal conductivity was faster. As the electrical resistivitydecreased with increased carbonization temperature, it was almost close to conductor aftercarbonization temperature of 1,000°C. When electricity has worked on the carbonized board by high voltage, the current and the electric power increased and surface temperature of carbonizedboard was high. KCI Citation Count: 1 This study is a basic research for practical applications of carbonized boards, which measured thermal conductivity and electrical properties of carbonized boards manufactured at different carbonization temperature ($400{\sim}1,100^{\circ}C$) using a medium density fiberboard, particleboard, plywood and wood (Fraxinus rhynchophylla). The highest value of thermal conductivity was 0.1326 m/k at carbonization temperature of $900^{\circ}C$ in the carbonized particleboard. Overall, the higher density of carbonized board, thermal conductivity was faster. As the electrical resistivity decreased with increased carbonization temperature, it was almost close to conductor after carbonization temperature of $1,000^{\circ}C$. When electricity has worked on the carbonized board by high voltage, the current and the electric power increased and surface temperature of carbonized board was high. 탄화보드의 실용화를 위한 기초연구로 중밀도섬유판, 파티클보드, 합판 및 물푸레나무 목재를 $400{\sim}1,100^{\circ}C$로 탄화하여 탄화온도에 따른 열전도율 및 전기적 성질을 측정하였다. 열전도율은 탄화 파티클보드의 탄화온도가 $900^{\circ}C$일 때 0.1326 m/k로 가장 우수하였으며, 전반적으로 탄화보드의 밀도가 클수록 열전도율이 빨랐다. 비저항값은 탄화온도가 높을수록 감소하여 탄화온도 $1,000^{\circ}C$ 이후에는 거의 도체에 가까운 값을 나타냈다. 높은 전압으로 탄화보드에 전기를 통했을 때 전류와 전력은 증가하였으며 표면온도가 높았다. 탄화보드의 실용화를 위한 기초연구로 중밀도섬유판, 파티클보드, 합판 및 물푸레나무 목재를 400∼1,100°C로 탄화하여 탄화온도에 따른 열전도율 및 전기적 성질을 측정하였다. 열전도율은 탄화 파티클보드의 탄화온도가 900°C일 때 0.1326 m/k로 가장 우수하였으며, 전반적으로 탄화보드의 밀도가 클수록 열전도율이 빨랐다. 비저항값은 탄화온도가 높을수록 감소하여 탄화온도 1,000°C 이후에는 거의 도체에 가까운 값을 나타냈다. 높은 전압으로 탄화보드에 전기를 통했을 때 전류와 전력은 증가하였으며 표면온도가 높았다. This study is a basic research for practical applications of carbonized boards, which measured thermal conductivity and electrical properties of carbonized boards manufactured at different carbonization temperature (400∼1,100°C) using a medium density fiberboard, particleboard, plywood and wood (Fraxinus rhynchophylla). The highest value of thermal conductivity was 0.1326 m/k at carbonization temperature of 900°C in the carbonized particleboard. Overall, the higher density of carbonized board, thermal conductivity was faster. As the electrical resistivity decreased with increased carbonization temperature, it was almost close to conductor after carbonization temperature of 1,000°C. When electricity has worked on the carbonized board by high voltage, the current and the electric power increased and surface temperature of carbonized board was high. |
Author | Sang Bum Park Jung Woo Hwang 박상범 김종인 Seung Won Oh 황정우 오승원 Jong In Kim |
Author_xml | – sequence: 1 fullname: 오승원 – sequence: 2 fullname: Seung Won Oh – sequence: 3 fullname: 박상범 – sequence: 4 fullname: Sang Bum Park – sequence: 5 fullname: 김종인 – sequence: 6 fullname: Jong In Kim – sequence: 7 fullname: 황정우 – sequence: 8 fullname: Jung Woo Hwang |
BackLink | https://www.kci.go.kr/kciportal/ci/sereArticleSearch/ciSereArtiView.kci?sereArticleSearchBean.artiId=ART001739865$$DAccess content in National Research Foundation of Korea (NRF) |
BookMark | eNo9jD9Lw0Achg9RsNZ-Apcsgkvg7n655DKW4p9qoSB1PpL0IiE1lcTFzWIGcalgsREqdBG7WbFD_UrN9TsYrcg7PLy8D-8WWo-6kVxDJUoBdItwvI5KBBNLxxZhm6iSJIGLgXDKKIcSOlvepsvngcomeT9dTG-0Vc8_Z_njSL1kmhrO1DgtRjWaaPm0rxVtMZ-qcU9T6Yd6u1PDBy1_n6uvLL8faCrrLZ9et9GG73QSWfljGbUO9lu1I73RPKzXqg095MB0ydsEmOE5hme5EnyMXc93DF8yA0xq-EwS6lG_LQkGbpsG8zDHtss9INI2XYAy2lvdRrEvQi8QXSf45XlXhLGonrbqgoLJCSvU3ZUaBslVIKJ20hHH1ZMmxQSwaQEzi9g_lzv_XiIu4-DCia8FEGoybsA3wex96Q |
ContentType | Journal Article |
DBID | HZB Q5X JDI ACYCR |
DEWEY | 674.1 |
DatabaseName | KISS(한국학술정보) Korean Studies Information Service System (KISS) B-Type KoreaScience Korean Citation Index |
DatabaseTitleList | |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Engineering |
DocumentTitleAlternate | 탄화온도가 탄화보드의 열전도율 및 전기적 성질에 미치는 영향 Effect of Carbonization Temperature on the Thermal Conductivity and Electric Properties of Carbonized Boards |
EISSN | 2233-7180 |
EndPage | 63 |
ExternalDocumentID | oai_kci_go_kr_ARTI_236815 JAKO201306735656593 3126584 |
GroupedDBID | .UV ALMA_UNASSIGNED_HOLDINGS HZB Q5X JDI ACYCR |
ID | FETCH-LOGICAL-k835-e8d1354ca4c7be3f00bcfa4fe543624f5e12c2fde10389645c0809b8c31e96b33 |
ISSN | 1017-0715 |
IngestDate | Wed Apr 16 06:37:21 EDT 2025 Fri Dec 22 11:58:52 EST 2023 Sat Aug 23 02:10:13 EDT 2025 |
IsOpenAccess | true |
IsPeerReviewed | true |
IsScholarly | true |
Issue | 1 |
Keywords | carbonized board wood electric properties wood-based panel thermal conductivity |
Language | Korean |
LinkModel | OpenURL |
MergedId | FETCHMERGED-LOGICAL-k835-e8d1354ca4c7be3f00bcfa4fe543624f5e12c2fde10389645c0809b8c31e96b33 |
Notes | The Korean Society of Wood Science & Technology KISTI1.1003/JNL.JAKO201306735656593 G704-000240.2013.41.1.008 |
OpenAccessLink | http://click.ndsl.kr/servlet/LinkingDetailView?cn=JAKO201306735656593&dbt=JAKO&org_code=O481&site_code=SS1481&service_code=01 |
PageCount | 6 |
ParticipantIDs | nrf_kci_oai_kci_go_kr_ARTI_236815 kisti_ndsl_JAKO201306735656593 kiss_primary_3126584 |
PublicationCentury | 2000 |
PublicationDate | 2013-01 |
PublicationDateYYYYMMDD | 2013-01-01 |
PublicationDate_xml | – month: 01 year: 2013 text: 2013-01 |
PublicationDecade | 2010 |
PublicationTitle | 목재공학 |
PublicationTitleAlternate | 목재공학(Journal of the Korean Wood Science and Technology) |
PublicationYear | 2013 |
Publisher | 한국목재공학회 |
Publisher_xml | – name: 한국목재공학회 |
SSID | ssib031825283 ssib051641553 ssib053377229 ssib007309044 |
Score | 1.8350776 |
Snippet | 탄화보드의 실용화를 위한 기초연구로 중밀도섬유판, 파티클보드, 합판 및 물푸레나무 목재를 400∼1,100°C로 탄화하여 탄화온도에 따른 열전도율 및 전기적 성질을 측정하였다. 열전도율은 탄화 파티클보드의 탄화온도가 900°C일 때 0.1326 m/k로 가장 우수하였으며, 전반적으로... This study is a basic research for practical applications of carbonized boards, which measured thermal conductivity and electrical properties of carbonized... |
SourceID | nrf kisti kiss |
SourceType | Open Website Open Access Repository Publisher |
StartPage | 58 |
SubjectTerms | carbonized board electric properties thermal conductivity wood wood based panel 임학 |
Title | 탄화온도가 탄화보드의 열전도율 및 전기적 성질에 미치는 영향 |
URI | https://kiss.kstudy.com/ExternalLink/Ar?key=3126584 http://click.ndsl.kr/servlet/LinkingDetailView?cn=JAKO201306735656593&dbt=JAKO&org_code=O481&site_code=SS1481&service_code=01 https://www.kci.go.kr/kciportal/ci/sereArticleSearch/ciSereArtiView.kci?sereArticleSearchBean.artiId=ART001739865 |
Volume | 41 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
ispartofPNX | 목재공학, 2013, 41(1), 178, pp.58-63 |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwnV3Nb9MwFLfWneCAgIEYH1OQ8KkqSmI7tY9OaTWGBpdO2i1q0gRNnTq0jwsHxEQPiMuQmFiRhrQLYjeG2GH8S2v2P_Cek6UBKvFxSZzn954_nmP_XhQ_E3Kv69YjEcOLFDpeXONOqGqqg7_9eQpeJsZj7uJu5MXH3vwSX1gWy1OVmdJfS1ub4f3o-cR9Jf9jVaCBXXGX7D9YtlAKBEiDfeEKFobrX9mYNh9QyajkmFCKKkg0qJJUS9r0qWyZLE19m0q7Oonbpz6jvkkoRlXDyEOurJpU3eQ1qLaNWKGygawamXyjvFUtcUF5Eqk5xTF5kOE7hlSnUubKlW006BZKAMlXWHksRkPtqnljpGMq7FEtylDaSGqqlWFrUt0wRUNzhOEXVBUfOc67xVQdlPuZEDTaHrOYpoAYsjBTKlBcqviYxUjKrGkulSLvLl-OWUzXZpXS5-oUmqD8fQXPuii-r2RLAq7jAMREec3gzm_vRrYAZHHocyiRT90_Bfn-ZfEtfolc0I-eYPF4cBCCbKFYhVSYg-dBLL5oFnMkzMjKHkMymJLdcnweAe4vHgVVPDMG_pM5rK9oCKAPcE42wB1DH2UFUFV_PSmhqvZlcil3hyydje0rZKq3dpVcLAXJnCFLZ68GZx920-HhaGdwevTSyp5H345H7_bTj0Mr3TtODwaQme4fWqOjHQueTk-O0oNtKx18TT-_TvfeWqMvJ-n34ejNrpUOt8_ef7pG2q1muzFfyw8DqfXASajFsuswwaMOj-phzBLbDqOkw5NYcIBgPBGx40Zu0o0x4L_yuMAI-iqUEXNi5YWMXSfT_bV-fINYXAk7kbbkkYy4kJHkIYIyCcjdTRIlZ8kMdk_wLAv3EjDHRZg-S-ZMdwX97sZqMMFcs-Qu9GPQi1YCjNmO96drQW89AM_0YeAyTzri5p-U3CIXxoPwNpneXN-K7wDs3QznzDj4AZlui3o |
linkProvider | ISSN International Centre |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=%ED%83%84%ED%99%94%EC%98%A8%EB%8F%84%EA%B0%80+%ED%83%84%ED%99%94%EB%B3%B4%EB%93%9C%EC%9D%98+%EC%97%B4%EC%A0%84%EB%8F%84%EC%9C%A8+%EB%B0%8F+%EC%A0%84%EA%B8%B0%EC%A0%81+%EC%84%B1%EC%A7%88%EC%97%90+%EB%AF%B8%EC%B9%98%EB%8A%94+%EC%98%81%ED%96%A5&rft.jtitle=%EB%AA%A9%EC%9E%AC%EA%B3%B5%ED%95%99&rft.au=%EC%98%A4%EC%8A%B9%EC%9B%90&rft.au=%EB%B0%95%EC%83%81%EB%B2%94&rft.au=%EA%B9%80%EC%A2%85%EC%9D%B8&rft.au=%ED%99%A9%EC%A0%95%EC%9A%B0&rft.date=2013-01-01&rft.issn=1017-0715&rft.volume=41&rft.issue=1&rft.spage=58&rft.epage=63&rft.externalDBID=n%2Fa&rft.externalDocID=JAKO201306735656593 |
thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=1017-0715&client=summon |
thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=1017-0715&client=summon |
thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=1017-0715&client=summon |