Electromigration에 의한 Sn-0.7Cu 솔더 금속간화합물 성장 예측 - 허민혁; Min-hyeok Heo; 강남현; Namhyun Kang; 박성훈; Seonghun Park; 김준기; Jun-ki Kim; 홍원식; Won Sik Hong (대한금속·재료학회지, 54(12), 2016)
Keywords: current density; electromigration; intermetallic compounds; modeling; Sn-0.7Cu solder; 재료공학