티타늄 음극기지의 양극산화 전해질 농도에 따른 구리전착층 표면 및 전기적 특성에 미치는 효과
Recently, the requirement for the ultra thin copper foil increases with smaller and miniaturized electronic components. Therefore, it is important to examine the surface state of substrate depending on the processing parameter during the anodic oxidation. This study investigated the effect of the va...
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Published in | 대한금속·재료학회지, 46(11) Vol. 46; no. 11; pp. 747 - 754 |
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Main Authors | , , , , , , , , , , , |
Format | Journal Article |
Language | Korean |
Published |
대한금속재료학회
01.12.2008
대한금속·재료학회 |
Subjects | |
Online Access | Get full text |
ISSN | 1738-8228 2288-8241 |
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Summary: | Recently, the requirement for the ultra thin copper foil increases with smaller and miniaturized electronic components. Therefore, it is important to examine the surface state of substrate depending on the processing parameter during the anodic oxidation. This study investigated the effect of the various electrolyte concentrations on anodizing of titanium anode prior to copper electrodeposition. Different surface morphology of anodized titanium was obtained at different electrolytic concentration 0.5 M to 3.0 M. In addition, the effect that the surfaces and the electrical characteristics on the electrodeposited copper layer was observed. In this study, surface anodized in the group containing 0.5M H2SO4 shows more uniform copper crystals with low surface roughness. the surface roughness and sheet resistance for 0.5M H2SO4 group were 1.353 μm and 0.104 mΩ/sq, respectively. |
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Bibliography: | The Korean Institute of Metals and Materials G704-000085.2008.46.11.008 |
ISSN: | 1738-8228 2288-8241 |