주울가열에 의한 저융점합금-에폭시 이중라인형 OLED 봉지
We suggest a new OLED encapsulation method involving an LMPA-epoxy double line structure using joule heating. First, an underlayer that consists of a heating layer, an insulating layer, and a sacrificial layer was manufactured in the form of a line with 0.5 mm width and thousands of Å thickness. A m...
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| Published in | 대한금속·재료학회지, 53(9) Vol. 53; no. 9; pp. 648 - 654 |
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| Main Authors | , , , |
| Format | Journal Article |
| Language | Korean |
| Published |
대한금속재료학회
05.09.2015
대한금속·재료학회 |
| Subjects | |
| Online Access | Get full text |
| ISSN | 1738-8228 2288-8241 |
| DOI | 10.3365/KJMM.2015.53.9.648 |
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| Abstract | We suggest a new OLED encapsulation method involving an LMPA-epoxy double line structure using joule heating. First, an underlayer that consists of a heating layer, an insulating layer, and a sacrificial layer was manufactured in the form of a line with 0.5 mm width and thousands of Å thickness. A mixture of Sn-58Bi and UV curing epoxy was then printed over the underlayer pattern. Applying 5.8 W of electrical power on the heating layer for 60 seconds, Sn-58Bi was separated from the epoxy. The LMPA-epoxy double line structure was stabilized and sufficient adhesion strength between the two substrates was secured by UV curing. The thickness of the Cu sacrificial layer and the content of the epoxy in the mixture were optimized through experiments. (Received August 11, 2014) |
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| AbstractList | We suggest a new OLED encapsulation method involving an LMPA-epoxy double line structure using joule heating. First, an underlayer that consists of a heating layer, an insulating layer, and a sacrificial layer was manufactured in the form of a line with 0.5 mm width and thousands of Å thickness. A mixture of Sn-58Bi and UV curing epoxy was then printed over the underlayer pattern. Applying 5.8 W of electrical power on the heating layer for 60 seconds, Sn-58Bi was separated from the epoxy. The LMPA-epoxy double line structure was stabilized and sufficient adhesion strength between the two substrates was secured by UV curing. The thickness of the Cu sacrificial layer and the content of the epoxy in the mixture were optimized through experiments. (Received August 11, 2014) We suggest a new OLED encapsulation method involving an LMPA-epoxy double line structure using joule heating. First, an underlayer that consists of a heating layer, an insulating layer, and a sacrificial layer was manufactured in the form of a line with 0.5 mm width and thousands of Å thickness. A mixture of Sn-58Bi and UV curing epoxy was then printed over the underlayer pattern. Applying 5.8 W of electrical power on the heating layer for 60 seconds, Sn-58Bi was separated from the epoxy. The LMPA-epoxy double line structure was stabilized and sufficient adhesion strength between the two substrates was secured by UV curing. The thickness of the Cu sacrificial layer and the content of the epoxy in the mixture were optimized through experiments. KCI Citation Count: 2 |
| Author | 박경민 문철희 Kyung Min Park Cheol Hee Moon |
| Author_xml | – sequence: 1 fullname: 박경민 – sequence: 2 fullname: Kyung Min Park – sequence: 3 fullname: 문철희 – sequence: 4 fullname: Cheol Hee Moon |
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| DocumentTitleAlternate | 주울가열에 의한 저융점합금-에폭시 이중라인형 OLED 봉지 OLED encapsulation with LMPA-epoxy double line structure using joule heating |
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| Notes | The Korean Institute of Metals and Materials G704-000085.2015.53.9.006 |
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| PublicationTitle | 대한금속·재료학회지, 53(9) |
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| Snippet | We suggest a new OLED encapsulation method involving an LMPA-epoxy double line structure using joule heating. First, an underlayer that consists of a heating... |
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| StartPage | 648 |
| SubjectTerms | alloys annealing melting OLED organic light emitting diode scanning electron microscopy (SEM) 재료공학 |
| Title | 주울가열에 의한 저융점합금-에폭시 이중라인형 OLED 봉지 |
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