폴리이미드 종류에 따른 연성 동박 적층판의 부착력 연구

Flexible copper clad laminates (FCCL) fabricated by sputtering has advantages in fine pitch etching and dimensional accuracy than previous casting or laminating type FCCL, But its lower adhesion is inevitable technical challenge to solve for commercializing it. Chromium (Cr) which strongly reacts wi...

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Published inBiuletyn Uniejowski Vol. 38; no. 2; pp. 49 - 54
Main Authors 이재원(Jae Won Lee), 김상호(Sang Ho Kim)
Format Journal Article
LanguageKorean
Published 한국표면공학회 2005
Subjects
기계공학
Tie-coating layer
Peel strength
FCCL
SRPI
CRPI
Online AccessGet full text
ISSN1225-8024
2299-8403
2288-8403

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Abstract Flexible copper clad laminates (FCCL) fabricated by sputtering has advantages in fine pitch etching and dimensional accuracy than previous casting or laminating type FCCL, But its lower adhesion is inevitable technical challenge to solve for commercializing it. Chromium (Cr) which strongly reacts with O moiety was used as tie-coating layer in order to improve low adhesion between copper (Cu) and polyimide (PI). Sputtering raw polyimide (SRPI) and casting raw polyimide (CRPI) were used as substrates at this research. PI was pretreated by plasma before sputtering, and each sample was varied with RF power and Cr thickness on sputtering. Peel strength of the FCCL on SRPI was higher than that on CRPI. Adhesion had maximum value when 10 nm of Cr was deposited on SRPI by RF power of 50 W. It seems to be by the formation of Cu-Cr-O solid solution at the metal-PI interface.
AbstractList Flexible copper clad laminates (FCCL) fabricated by sputtering has advantages in fine pitch etching and dimensional accuracy than previous casting or laminating type FCCL, But its lower adhesion is inevitable technical challenge to solve for commercializing it. Chromium (Cr) which strongly reacts with O moiety was used as tie-coating layer in order to improve low adhesion between copper (Cu) and polyimide (PI). Sputtering raw polyimide (SRPI) and casting raw polyimide (CRPI) were used as substrates at this research. PI was pretreated by plasma before sputtering, and each sample was varied with RF power and Cr thickness on sputtering. Peel strength of the FCCL on SRPI was higher than that on CRPI. Adhesion had maximum value when 10 nm of Cr was deposited on SRPI by RF power of 50 W. It seems to be by the formation of Cu-Cr-O solid solution at the metal-PI interface.
Flexible copper clad laminates(FCCL) fabricated by sputtering has advantages in fine pitch etching and dimensional accuracy than previous casting or laminating type FCCL, But its lower adhesion is inevitable technical challenge to solve for commercializing it. Chromium(Cr) which strongly reacts with O moiety was used as tie-coating layer in order to improve low adhesion between copper(Cu) and polyimide(PI). Sputtering raw polyimide(SRPI) and casting raw polyimide(CRPI) were used as substrates at this research. PI was pretreated by plasma before sputtering, and each sample was varied with RF power and Cr thickness on sputtering. Peel strength of the FCCL on SRPI was higher than that on CRPI. Adhesion had maximum value when 10nm of Cr was deposited on SRPI by RF power of 50W. It seems to be by the formation of Cu- Cr-O solid solution at the metal-PI interface. KCI Citation Count: 1
Author 이재원(Jae Won Lee)
김상호(Sang Ho Kim)
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DocumentTitleAlternate Research on the Adhesion of Flexible Copper Clad Laminates According to Species of Polymide
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Keywords Tie-coating layer
Peel strength
FCCL
SRPI
CRPI
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Snippet Flexible copper clad laminates (FCCL) fabricated by sputtering has advantages in fine pitch etching and dimensional accuracy than previous casting or...
Flexible copper clad laminates(FCCL) fabricated by sputtering has advantages in fine pitch etching and dimensional accuracy than previous casting or laminating...
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SubjectTerms 기계공학
Title 폴리이미드 종류에 따른 연성 동박 적층판의 부착력 연구
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