無電解銅めっきによる微細ホールのボトムアップ堆積

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Published in表面技術 Vol. 58; no. 8; p. 450
Main Authors 王, 増林, 新宮原, 正三
Format Journal Article
LanguageJapanese
Published 一般社団法人 表面技術協会 01.08.2007
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ISSN0915-1869
1884-3409
DOI10.4139/sfj.58.450

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Author 新宮原, 正三
王, 増林
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  organization: 鎮西師範大学 化学材料学院
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  organization: 関西大学 システム理工学部
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References 14) Y. Shacham-Diamand and V. Dubin ; Microelectric Engineering, 33, 47 (1997).
15) M. Hasegawa, N. Yamachika, Y. Shacham-Diamand, Y. Okinaka and T. Osaka ; Appl. Phys. Lett. 90, 101916 (2007).
7) Z. Wang, O. Yaegashi, H. Sakaue, T. Takahagi and S. Shingubara ; J. Appl. Phys., 94, 4697, (2003).
12) Z. Wang, R. Obata, S. Shingubara, H. Sakaue and T. Takahagi ; Electrochim. Acta., 51, 2442 (2006).
11) Z. Wang, O. Yaegashi, H. Sakaue, T. Takahagi and S. Shingubara ; Jpn. J. Appl. Phys., 43, 7000, (2004).
6) Z. Wang, O. Yaegashi, H. Sakaue, T. Takahagi and S. Shingubara ; Jpn. J. Appl. Phys., 10B, L1223 (2003).
2) ITRS semiconductor roadmap : http://www.itrs.net
5) S. Lopatain, Y. Shacham-Diamand, V. Dubin, J. Pellerin, B. Zhao P. K. Vasudev ; Advanced Metallization Conf. 1996, 169 (1996).
3) T. P. Mofatt, J. E. Bonevitch, W. H. Huber, A. Stanishevsky, D. R. Kelly, G. R. DStafford and D. Jessell ; J. Electrochem. Soc., 147, 4524 (2000).
1) P. C. Andricacos, C. Uzoh, J. O. Dukovic, J. Horkans and Y. Deligianni ; IBM J. Res. Develop., 42, 567 (1998).
9) S. Shingubara, Z. Wang, O. Yaegashi, R. Obata, H. Sakaue and T. Takahagi ; Electrochem. Solid-State Lett., 7, C78 (2004).
10) Z. Wang, O. Yaegashi, H. Sakaue, T. Takahagi and S. Shingubara ; J. Electrochem. Soc., 151, C781 (2004).
4) M. Kang and A. A. Gewirth ; J. Electrochemi. Soc., 150, C426 (2003).
8) S. Shingubara, Z. Wang, O. Yaegashi, R. Obata, H. Sakaue and T. Takahagi ; Technical Digest of IEEE IEDM, p. 147 (2003).
13) Y. Shacham-Diamand, V. Dubin and M. Angyal ; Thin Solid Films, 262, 93 (1995).
References_xml – reference: 14) Y. Shacham-Diamand and V. Dubin ; Microelectric Engineering, 33, 47 (1997).
– reference: 15) M. Hasegawa, N. Yamachika, Y. Shacham-Diamand, Y. Okinaka and T. Osaka ; Appl. Phys. Lett. 90, 101916 (2007).
– reference: 8) S. Shingubara, Z. Wang, O. Yaegashi, R. Obata, H. Sakaue and T. Takahagi ; Technical Digest of IEEE IEDM, p. 147 (2003).
– reference: 3) T. P. Mofatt, J. E. Bonevitch, W. H. Huber, A. Stanishevsky, D. R. Kelly, G. R. DStafford and D. Jessell ; J. Electrochem. Soc., 147, 4524 (2000).
– reference: 9) S. Shingubara, Z. Wang, O. Yaegashi, R. Obata, H. Sakaue and T. Takahagi ; Electrochem. Solid-State Lett., 7, C78 (2004).
– reference: 10) Z. Wang, O. Yaegashi, H. Sakaue, T. Takahagi and S. Shingubara ; J. Electrochem. Soc., 151, C781 (2004).
– reference: 1) P. C. Andricacos, C. Uzoh, J. O. Dukovic, J. Horkans and Y. Deligianni ; IBM J. Res. Develop., 42, 567 (1998).
– reference: 6) Z. Wang, O. Yaegashi, H. Sakaue, T. Takahagi and S. Shingubara ; Jpn. J. Appl. Phys., 10B, L1223 (2003).
– reference: 7) Z. Wang, O. Yaegashi, H. Sakaue, T. Takahagi and S. Shingubara ; J. Appl. Phys., 94, 4697, (2003).
– reference: 11) Z. Wang, O. Yaegashi, H. Sakaue, T. Takahagi and S. Shingubara ; Jpn. J. Appl. Phys., 43, 7000, (2004).
– reference: 12) Z. Wang, R. Obata, S. Shingubara, H. Sakaue and T. Takahagi ; Electrochim. Acta., 51, 2442 (2006).
– reference: 4) M. Kang and A. A. Gewirth ; J. Electrochemi. Soc., 150, C426 (2003).
– reference: 13) Y. Shacham-Diamand, V. Dubin and M. Angyal ; Thin Solid Films, 262, 93 (1995).
– reference: 2) ITRS semiconductor roadmap : http://www.itrs.net/
– reference: 5) S. Lopatain, Y. Shacham-Diamand, V. Dubin, J. Pellerin, B. Zhao P. K. Vasudev ; Advanced Metallization Conf. 1996, 169 (1996).
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Title 無電解銅めっきによる微細ホールのボトムアップ堆積
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