接着接合の易解体における浸漬前処理の有効性評価
Saved in:
Published in | 環境資源工学 Vol. 70; no. 2; pp. 65 - 72 |
---|---|
Main Authors | , , , , |
Format | Journal Article |
Language | Japanese |
Published |
一般社団法人 環境資源工学会
2023
|
Subjects | |
Online Access | Get full text |
ISSN | 1348-6012 1349-9262 |
DOI | 10.4144/rpsj.70.65 |
Cover
Author | 佐藤, 啓太 所, 千晴 小板, 丈敏 久保田, 明紀子 小山, 恵史 |
---|---|
Author_xml | – sequence: 1 fullname: 小板, 丈敏 organization: 早稲田大学理工学術院 – sequence: 1 fullname: 佐藤, 啓太 organization: 早稲田大学大学院創造理工学研究科地球・環境資源理工学専攻 – sequence: 1 fullname: 小山, 恵史 organization: 早稲田大学理工学術院 – sequence: 1 fullname: 久保田, 明紀子 organization: 早稲田大学理工学術院 – sequence: 1 fullname: 所, 千晴 organization: 東京大学工学系研究科 |
BookMark | eNo9kD9Lw0AAxQ-pYK1d_B6J9y93l8FBSv0DBRedwyW504RaS9LFrXFQ26JUiuCgg4gWUdwEBfXLpEn7MbQqLr_3eDze8OZBobHfUAAsImhSROlS1IxDk0OTWTOgiAi1DRszXPjxwmAQ4TlQjuPAhRAzDm1BiqCan92Nr9vfzPonafKcXw4mw9vRxyBNHtOkmybn6WEvf3nN35-yzml2fD_uH01rV52s-5a3h5OHi9HnzQKY1bIeq_KflsD2anWrsm7UNtc2Kis1I8SUQYO7yvUthT3KqBCCeFx70NeMIZ8QLrnEUGPOCedSI6yEgEIRqIhPlfYxdkkJLP_uhnFL7iinGQV7MjpwZNQKvLpypg84HDp4Cmb9596ujJxQki8nFnAz |
ContentType | Journal Article |
Copyright | 2023 環境資源工学会 |
Copyright_xml | – notice: 2023 環境資源工学会 |
DOI | 10.4144/rpsj.70.65 |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Engineering |
EISSN | 1349-9262 |
EndPage | 72 |
ExternalDocumentID | article_rpsj_70_2_70_65_article_char_ja |
GroupedDBID | 2WC ABJNI ACGFS ALMA_UNASSIGNED_HOLDINGS ARCSS JSF KQ8 OK1 RJT |
ID | FETCH-LOGICAL-j2460-7bebd5e2c4648883c7fc0df661d337a7a20f277377af12e8808e30e3d4efd22b3 |
ISSN | 1348-6012 |
IngestDate | Wed Sep 03 06:31:25 EDT 2025 |
IsDoiOpenAccess | true |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | true |
Issue | 2 |
Language | Japanese |
LinkModel | OpenURL |
MergedId | FETCHMERGED-LOGICAL-j2460-7bebd5e2c4648883c7fc0df661d337a7a20f277377af12e8808e30e3d4efd22b3 |
OpenAccessLink | https://www.jstage.jst.go.jp/article/rpsj/70/2/70_65/_article/-char/ja |
PageCount | 8 |
ParticipantIDs | jstage_primary_article_rpsj_70_2_70_65_article_char_ja |
PublicationCentury | 2000 |
PublicationDate | 2023 |
PublicationDateYYYYMMDD | 2023-01-01 |
PublicationDate_xml | – year: 2023 text: 2023 |
PublicationDecade | 2020 |
PublicationTitle | 環境資源工学 |
PublicationTitleAlternate | 環境資源工学 |
PublicationYear | 2023 |
Publisher | 一般社団法人 環境資源工学会 |
Publisher_xml | – name: 一般社団法人 環境資源工学会 |
References | 17. Y. Liu, B.X. Du, D. Du: International Transactions on Electrical Energy Systems, 23, pp. 72–82 (2013) 24. Y. Zhang, R.D. Adams, L.F.M. Da Silva: International Journal of Adhesion & Adhesives, 50, pp. 85–92 (2014) 11. Y. Egawa, T. Koita, S. Lim, T. Namihira, C. Tokoro: IEEE Transactions on Dielectrics and Electrical Insulation, 30, 1, pp. 449–457 (2023) 22. J. Zhou and J.P. Lucas: Polymer, 40, pp. 5513–5522 (1999) 6. M.D. Banea, L.F.M. Da Silva, R.D.S.G. Campilho, C. Sato: The Journal of Adhesion, 90, pp. 16–40 (2014) 5. A.L. Loureiro, L.F.M. Da Silva, C. Sato, M.A.V. Figueiredo: The Journal of Adhesion, 86, pp. 765–787 (2010) 20. R. Kahraman and M. Harthi: International Journal of Adhesion & Adhesives, 25, pp. 337–341 (2005) 4. P. Feraboli and A. Masini: Composites Part B: Engineering, 35, 4, pp. 323–330 (2004) 1. A. Taub, E.D. Moor, A. Luo, D.K. Matlock, J.G. Speer, U. Vaidya: Annual Review of Materials Research, 49, pp. 327–359 (2019) 18. F. Gerdinand, M. Budde, M. Kurrat: Proceedings of the 2003 IEEE Bologna PowerTech, 2, pp. 809–813 (2003) 7. T.A. Barnes and I.R. Pashby: Journal of Materials Processing Technology, 99, pp. 62–71 (2000) 10. M. Kondo, T. Koita, S. Lim, T. Namihira, C. Tokoro: IEEE Transactions on Plasma Science, 50, 11, pp. 4636–4649 (2022) 23. S. Bal, S. Saha: International Journal of Damage Mechanics, 26, pp. 758–770 (2017) 2. M.D. Banea: Reviews of Adhesion and Adhesives, 7, 1, pp. 33–50 (2019) 3. N.D.D. Silva, J.J.M. Machado, E.A.S. Marques, P.M.G.P. Moreira, L.F.M. Da Silva: Proceedings of the Institution of Mechanical Engineers. Part D, Journal of Automobile Engineering, 234, 14, pp. 3385–3397 (2020) 15. S. Lim, Y. Imaizumi, K. Mochidzuki, T. Koita, T. Namihira, C. Tokoro: IEEE Transactions on Plasma Science, 49, 9, pp. 2857–2865 (2021) 19. F. Gerdinand, M. Budde, M. Kurrat: Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials, pp. 267–270 (2006) 8. T.A. Barnes and I.R. Pashby: Journal of Materials Processing Technology, 99, pp. 72–79 (2000) 13. S. Lim, K. Teruya, F. Mizumoto, M. Asao, T. Koita, T. Namihira, C. Tokoro: IEEE Transactions on Plasma Science, 50, 10, pp. 3625–3634 (2022) 9. T. Koita, M. Kondo, S. Lim, M. Inutsuka, T. Namihira, S. Oyama, C. Tokoro: IEEE Transactions on Plasma Science, 49, 12, pp. 3860–3872 (2021) 14. K. Teruya, S. Lim, K. Mochidzuki, T. Koita, F. Mizumoto, M. Asao, T. Namihira, C. Tokoro: International Journal of Plasma Environmental Science and Technology, 16, 1, pp. 1–13 (2022) 12. C. Tokoro, S. Lim, K. Teruya, M. Kondo, K. Mochidzuki, T. Namihira, Y. Kikuchi: Waste Management, 125, 15, pp. 58–66 (2021) 16. M. Kondo, S. Lim, T. Koita, T. Namihira, C. Tokoro: Results in Engineering, 12, pp. 1–10 (2021) 21. J. Zhou and J.P. Lucas: Polymer, 40, pp. 5505–5512 (1999) |
References_xml | – reference: 23. S. Bal, S. Saha: International Journal of Damage Mechanics, 26, pp. 758–770 (2017) – reference: 12. C. Tokoro, S. Lim, K. Teruya, M. Kondo, K. Mochidzuki, T. Namihira, Y. Kikuchi: Waste Management, 125, 15, pp. 58–66 (2021) – reference: 18. F. Gerdinand, M. Budde, M. Kurrat: Proceedings of the 2003 IEEE Bologna PowerTech, 2, pp. 809–813 (2003) – reference: 11. Y. Egawa, T. Koita, S. Lim, T. Namihira, C. Tokoro: IEEE Transactions on Dielectrics and Electrical Insulation, 30, 1, pp. 449–457 (2023) – reference: 3. N.D.D. Silva, J.J.M. Machado, E.A.S. Marques, P.M.G.P. Moreira, L.F.M. Da Silva: Proceedings of the Institution of Mechanical Engineers. Part D, Journal of Automobile Engineering, 234, 14, pp. 3385–3397 (2020) – reference: 5. A.L. Loureiro, L.F.M. Da Silva, C. Sato, M.A.V. Figueiredo: The Journal of Adhesion, 86, pp. 765–787 (2010) – reference: 9. T. Koita, M. Kondo, S. Lim, M. Inutsuka, T. Namihira, S. Oyama, C. Tokoro: IEEE Transactions on Plasma Science, 49, 12, pp. 3860–3872 (2021) – reference: 14. K. Teruya, S. Lim, K. Mochidzuki, T. Koita, F. Mizumoto, M. Asao, T. Namihira, C. Tokoro: International Journal of Plasma Environmental Science and Technology, 16, 1, pp. 1–13 (2022) – reference: 17. Y. Liu, B.X. Du, D. Du: International Transactions on Electrical Energy Systems, 23, pp. 72–82 (2013) – reference: 4. P. Feraboli and A. Masini: Composites Part B: Engineering, 35, 4, pp. 323–330 (2004) – reference: 10. M. Kondo, T. Koita, S. Lim, T. Namihira, C. Tokoro: IEEE Transactions on Plasma Science, 50, 11, pp. 4636–4649 (2022) – reference: 13. S. Lim, K. Teruya, F. Mizumoto, M. Asao, T. Koita, T. Namihira, C. Tokoro: IEEE Transactions on Plasma Science, 50, 10, pp. 3625–3634 (2022) – reference: 19. F. Gerdinand, M. Budde, M. Kurrat: Proceedings of the IEEE International Conference on Properties and Applications of Dielectric Materials, pp. 267–270 (2006) – reference: 22. J. Zhou and J.P. Lucas: Polymer, 40, pp. 5513–5522 (1999) – reference: 8. T.A. Barnes and I.R. Pashby: Journal of Materials Processing Technology, 99, pp. 72–79 (2000) – reference: 24. Y. Zhang, R.D. Adams, L.F.M. Da Silva: International Journal of Adhesion & Adhesives, 50, pp. 85–92 (2014) – reference: 7. T.A. Barnes and I.R. Pashby: Journal of Materials Processing Technology, 99, pp. 62–71 (2000) – reference: 1. A. Taub, E.D. Moor, A. Luo, D.K. Matlock, J.G. Speer, U. Vaidya: Annual Review of Materials Research, 49, pp. 327–359 (2019) – reference: 20. R. Kahraman and M. Harthi: International Journal of Adhesion & Adhesives, 25, pp. 337–341 (2005) – reference: 16. M. Kondo, S. Lim, T. Koita, T. Namihira, C. Tokoro: Results in Engineering, 12, pp. 1–10 (2021) – reference: 2. M.D. Banea: Reviews of Adhesion and Adhesives, 7, 1, pp. 33–50 (2019) – reference: 6. M.D. Banea, L.F.M. Da Silva, R.D.S.G. Campilho, C. Sato: The Journal of Adhesion, 90, pp. 16–40 (2014) – reference: 21. J. Zhou and J.P. Lucas: Polymer, 40, pp. 5505–5512 (1999) – reference: 15. S. Lim, Y. Imaizumi, K. Mochidzuki, T. Koita, T. Namihira, C. Tokoro: IEEE Transactions on Plasma Science, 49, 9, pp. 2857–2865 (2021) |
SSID | ssib002670983 ssib003171110 ssj0069521 ssib031740820 ssib000961627 ssib002484399 ssib002670966 |
Score | 2.30451 |
SourceID | jstage |
SourceType | Publisher |
StartPage | 65 |
SubjectTerms | リサイクル 接着接合 易解体 浸漬処理 絶縁材料 |
Title | 接着接合の易解体における浸漬前処理の有効性評価 |
URI | https://www.jstage.jst.go.jp/article/rpsj/70/2/70_65/_article/-char/ja |
Volume | 70 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
ispartofPNX | 環境資源工学, 2023, Vol.70(2), pp.65-72 |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwnR3LahRBcIjxogfxiW9ysE8ycaanpx_Hnt1ZgoIgJJDbsjPbc9hDDHlcPGU9qIkokSB40IOIBlG8CQrqz2x2k1_wZlX3jJmVHGJgaWqrq7te03RV0w_Pu1EoGEZdqvyMG0hQChb6khfGV7nMIUKQxrjdFnf5zBy7PR_PTxz7Xdu1tLqSTecPDjxXchSvAg78iqdk_8OzfzsFBMDgXyjBw1Aeysck5USmRMckFUQ1cdfCPiYmKiBSkjSCaJHoFKuUJCoiqSRaEA0AI0nTYhxNUgJSl4AKLUCJTLB5EpNEWqBBdANZSEVk0wLQIbdiAFM-zrSBZEijSaKshAEKgGIoomIrBsgc1gNl2xUlSYANNQhgxU4iZIQCaGQEVYkoldVNEKD6fGwNCNKy_JskaeGnZBlJaxOOfGVrn95ZIkAmCrpkjj5GMrRPjCitD-gfgBB_lp6j1omVB-oSOtY_mMrp2kKRUD-GnZQNwTXgOMAmzPrRauTeOK1WZdyRaTuCKlWswKAQesOKDYZEqRPrXo4GKw0Mttc3j2ZV275BlK7NYBGTPmTZTkNT4ZSPF0PWpz33Xks5vGltDnNvd5TRkHtX6d95lkEaDoNjaXG5Ny2C6arF2L3l5ahoI1FbBG2KBY_bFR5PFbZ7kNocp0KEuBv3zr1aZqB4yGl9JUGOZ85472B95QH_1yJlCIvDWmQLf_Fl9aAK0riKyyOZpbXczcWo1619rSAq7UGOVu3vtCHn7GnvVJkrTmmnyhlvotc5652s3SB6zktHz9_vvlmDcrj5ZND_Mnq1tbf9bufn1qD_adDfGPRfDB4-HX39Nvrxebj-bPj4w-7mIyR7vT7c-D5a2977-HLn19vz3lwrnW3M-OXLKH6PMh74IjNZNzY0ZxwmYBnlosiDbgGxdjeKREd0aFCAVSMhOkVIDczR0kSBibrMFF1Ks-iCN7lwf8Fc9KZ4xoIiyw3DQN0EoTQxyxVeD2xyluXiksedDdqL7vqb9iEde_moDa94J3BEuXXOq97kytKquQaR_0p23X4jfwCHRcy9 |
linkProvider | Colorado Alliance of Research Libraries |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=%E6%8E%A5%E7%9D%80%E6%8E%A5%E5%90%88%E3%81%AE%E6%98%93%E8%A7%A3%E4%BD%93%E3%81%AB%E3%81%8A%E3%81%91%E3%82%8B%E6%B5%B8%E6%BC%AC%E5%89%8D%E5%87%A6%E7%90%86%E3%81%AE%E6%9C%89%E5%8A%B9%E6%80%A7%E8%A9%95%E4%BE%A1&rft.jtitle=%E7%92%B0%E5%A2%83%E8%B3%87%E6%BA%90%E5%B7%A5%E5%AD%A6&rft.au=%E5%B0%8F%E6%9D%BF%2C+%E4%B8%88%E6%95%8F&rft.au=%E4%BD%90%E8%97%A4%2C+%E5%95%93%E5%A4%AA&rft.au=%E5%B0%8F%E5%B1%B1%2C+%E6%81%B5%E5%8F%B2&rft.au=%E4%B9%85%E4%BF%9D%E7%94%B0%2C+%E6%98%8E%E7%B4%80%E5%AD%90&rft.date=2023&rft.pub=%E4%B8%80%E8%88%AC%E7%A4%BE%E5%9B%A3%E6%B3%95%E4%BA%BA+%E7%92%B0%E5%A2%83%E8%B3%87%E6%BA%90%E5%B7%A5%E5%AD%A6%E4%BC%9A&rft.issn=1348-6012&rft.eissn=1349-9262&rft.volume=70&rft.issue=2&rft.spage=65&rft.epage=72&rft_id=info:doi/10.4144%2Frpsj.70.65&rft.externalDocID=article_rpsj_70_2_70_65_article_char_ja |
thumbnail_l | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=1348-6012&client=summon |
thumbnail_m | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=1348-6012&client=summon |
thumbnail_s | http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=1348-6012&client=summon |