Sn-Sb-Ag 系はんだダイボンド接合部のパワーサイクル損傷挙動に及ぼす添加元素の影響
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| Published in | スマートプロセス学会誌 Vol. 11; no. 5; pp. 194 - 201 |
|---|---|
| Main Authors | , , , , |
| Format | Journal Article |
| Language | Japanese |
| Published |
一般社団法人 スマートプロセス学会 （旧高温学会）
10.09.2022
|
| Online Access | Get full text |
| ISSN | 2186-702X 2187-1337 |
| DOI | 10.7791/jspmee.11.194 |
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| Author | 三ツ井, 恒平 荘司, 郁夫 渡邉, 裕彦 小林, 竜也 山中, 佑太 |
|---|---|
| Author_xml | – sequence: 1 fullname: 渡邉, 裕彦 organization: 富士電機株式会社 生産調達本部生産技術センター – sequence: 1 fullname: 三ツ井, 恒平 organization: 富士電機株式会社 生産調達本部生産技術センター – sequence: 1 fullname: 小林, 竜也 organization: 群馬大学大学院理工学府 – sequence: 1 fullname: 山中, 佑太 organization: 群馬大学大学院理工学府 – sequence: 1 fullname: 荘司, 郁夫 organization: 群馬大学大学院理工学府 |
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| Copyright | 2022 一般社団法人 スマートプロセス学会 |
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| References | Y. Zhong, W. Liu, C. Wang, X. Zhao and J. F. T. M. Caers: “The Influence of Strengthening and Recrystallization to the Cracking Behaivor of Ni, Sb, Bi Alloyed SnAgCu Solder during ThermalCycling”, Materials Science & Engineering A, 652 （2016）, 264-270. K. Mitsui, I. Shohji, T. Kobayashi and H. Watanabe: “Effect of Addition of Trace Ni and Ge into Sn-Sb-Ag High Temperature Leadfree Solder Alloy on its Mechanical Properties”, Journal of SmartProcessing, 9-3 （2019）, 133-139. （in Japanese） J. B. Libot, J. Alexis, O. Dalverny, L. Arnaud, P. Milesi and F. Dulondel: “Microstructural Evolutions of Sn-3.0Ag-0.5Cu Solder Joints during Thermal Cycling”, Microelectronics Reliability, 83 （2018）, 64-76. M. Yamamoto, I. Shohji, T. Kobayashi and H. Watanabe: “Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-free Solder”, Materials, 14 （2021）,3799. S. A. Belyakov, R. J. Coyle, B. Arfael, J. W. Xian and C. M. Gourlay: “Microstructure and Damage Evolution during Thermal Cycling of Sn-Ag-Cu Solders Containing Antimony”, Journal of ELECTROTIC MATERIALS, 50-3 （2021）, 825-841. K. Suganuma: “Mounting and Reliability Evaluation Technologies for SiC/GaN Power Semiconductors”, The Nikkan Kogyo Shimbun, （2014）, 44-45. （in Japanese） Y. Yamada: “Characterization Method of Joints for Power Semiconductor Device Packaging”, Journal of Japan Institute of Electronics Packaging, 21-6 （2018）, 579-585. （in Japanese） I. Shohji, S. Tsunoda, H. Watanabe, T. Asai and M. Nagano: “Reliability of Solder Joint with Sn-Ag-Cu-Ni-Ge Lead-free Alloy under Heat Exposure Conditions”, Materials Transactions, 46-12,（2005）, 2737-2744. A. Garams, J. Jaeschke, O. Wittler, B. Fabian and S. Thomas: “FEMbased Combined Degradation Model of Wire Bond and Die-attach for Lifetime Estimation of Power Electronics”, Microelectronics Reliability, 111 （2020）, 113683. T. Y. Hung, C. J. Huang, C. C. Lee, C. C Wang, K. C. Lu and K. N. Chiang: “Investigation of Solder Crack Behavior and Fatigue Life of the Power Module on Different Thermal Cycling Period”,Microelectronic Engineering, 107 （2013）, 125-129. J. Mei, R. Hang, O. Lanier, T. Grözinger, and A. Zimmermann: “Effect of Joule Heating on the Reliability of Solder Joints under Power Cycling Conditions”, Microelectronics Reliability, 88-90 (2018）, 684-690. T. Miyazaki and O. Ikeda: “Development of Sn-Cu Based Solder for Power Modules”, Journal of Smart Processing, 4-4 （2015）, 184-189. （in Japanese） M. Nakamura: “New Pre-treatment Process “Direct Plating” for Decorative Plating on Plastic”, Journal of Surface Finishing Society of Japan, 53-7, （2002）, 440-442. （in Japanese） K. Hosoya and Y. Kariya: “Fracture Mechanism and Its Dominant Factors of Sn-Ag Die Attach Joint in Power Cycle Test”, Microjoining and Assembly Technology in Electronics, 26 （2020）,187-192. （in Japanese） E. George and M. Pecht: “RoHS Compliance in Safety and Reliability Critical Electronics”, Microelectronics Reliability, 65 （2016）, 1-7. J. W. Xian, S. A. Belyakov and C. M. Gourlay: “Time-Lapse Imaging of Ag3Sn Thermal Coarsening in Sn-3.0Ag-0.5Cu Solder Joints”, Journal of ELECTRONIC MATERALS, 50-3, （2020）, 786-794. |
| References_xml | – reference: J. Mei, R. Hang, O. Lanier, T. Grözinger, and A. Zimmermann: “Effect of Joule Heating on the Reliability of Solder Joints under Power Cycling Conditions”, Microelectronics Reliability, 88-90 (2018）, 684-690. – reference: Y. Yamada: “Characterization Method of Joints for Power Semiconductor Device Packaging”, Journal of Japan Institute of Electronics Packaging, 21-6 （2018）, 579-585. （in Japanese） – reference: T. Y. Hung, C. J. Huang, C. C. Lee, C. C Wang, K. C. Lu and K. N. Chiang: “Investigation of Solder Crack Behavior and Fatigue Life of the Power Module on Different Thermal Cycling Period”,Microelectronic Engineering, 107 （2013）, 125-129. – reference: M. Nakamura: “New Pre-treatment Process “Direct Plating” for Decorative Plating on Plastic”, Journal of Surface Finishing Society of Japan, 53-7, （2002）, 440-442. （in Japanese） – reference: E. George and M. Pecht: “RoHS Compliance in Safety and Reliability Critical Electronics”, Microelectronics Reliability, 65 （2016）, 1-7. – reference: Y. Zhong, W. Liu, C. Wang, X. Zhao and J. F. T. M. Caers: “The Influence of Strengthening and Recrystallization to the Cracking Behaivor of Ni, Sb, Bi Alloyed SnAgCu Solder during ThermalCycling”, Materials Science & Engineering A, 652 （2016）, 264-270. – reference: J. W. Xian, S. A. Belyakov and C. M. Gourlay: “Time-Lapse Imaging of Ag3Sn Thermal Coarsening in Sn-3.0Ag-0.5Cu Solder Joints”, Journal of ELECTRONIC MATERALS, 50-3, （2020）, 786-794. – reference: S. A. Belyakov, R. J. Coyle, B. Arfael, J. W. Xian and C. M. Gourlay: “Microstructure and Damage Evolution during Thermal Cycling of Sn-Ag-Cu Solders Containing Antimony”, Journal of ELECTROTIC MATERIALS, 50-3 （2021）, 825-841. – reference: M. Yamamoto, I. Shohji, T. Kobayashi and H. Watanabe: “Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-free Solder”, Materials, 14 （2021）,3799. – reference: J. B. Libot, J. Alexis, O. Dalverny, L. Arnaud, P. Milesi and F. Dulondel: “Microstructural Evolutions of Sn-3.0Ag-0.5Cu Solder Joints during Thermal Cycling”, Microelectronics Reliability, 83 （2018）, 64-76. – reference: K. Suganuma: “Mounting and Reliability Evaluation Technologies for SiC/GaN Power Semiconductors”, The Nikkan Kogyo Shimbun, （2014）, 44-45. （in Japanese） – reference: I. Shohji, S. Tsunoda, H. Watanabe, T. Asai and M. Nagano: “Reliability of Solder Joint with Sn-Ag-Cu-Ni-Ge Lead-free Alloy under Heat Exposure Conditions”, Materials Transactions, 46-12,（2005）, 2737-2744. – reference: K. Mitsui, I. Shohji, T. Kobayashi and H. Watanabe: “Effect of Addition of Trace Ni and Ge into Sn-Sb-Ag High Temperature Leadfree Solder Alloy on its Mechanical Properties”, Journal of SmartProcessing, 9-3 （2019）, 133-139. （in Japanese） – reference: T. Miyazaki and O. Ikeda: “Development of Sn-Cu Based Solder for Power Modules”, Journal of Smart Processing, 4-4 （2015）, 184-189. （in Japanese） – reference: K. Hosoya and Y. Kariya: “Fracture Mechanism and Its Dominant Factors of Sn-Ag Die Attach Joint in Power Cycle Test”, Microjoining and Assembly Technology in Electronics, 26 （2020）,187-192. （in Japanese） – reference: A. Garams, J. Jaeschke, O. Wittler, B. Fabian and S. Thomas: “FEMbased Combined Degradation Model of Wire Bond and Die-attach for Lifetime Estimation of Power Electronics”, Microelectronics Reliability, 111 （2020）, 113683. |
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| Title | Sn-Sb-Ag 系はんだダイボンド接合部のパワーサイクル損傷挙動に及ぼす添加元素の影響 |
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