電解銅箔の低粗度化

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Bibliographic Details
Published in表面技術 Vol. 72; no. 6; pp. 345 - 351
Main Author 松田, 光由
Format Journal Article
LanguageJapanese
Published 一般社団法人 表面技術協会 01.06.2021
Subjects
5G
Electrodeposited Copper Foil
Signal Integrity
Surface roughness
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ISSN:0915-1869
1884-3409
DOI:10.4139/sfj.72.345