APA (7th ed.) Citation

NISHIYAMA, I., & OMIYA, M. (2011). Evaluation of Interfacial Strength of Copper Thin Film on Printed Circuit Board with Micro Cutting System. TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A, 77(778), 970-979. https://doi.org/10.1299/kikaia.77.970

Chicago Style (17th ed.) Citation

NISHIYAMA, Ituo, and Masaki OMIYA. "Evaluation of Interfacial Strength of Copper Thin Film on Printed Circuit Board with Micro Cutting System." TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A 77, no. 778 (2011): 970-979. https://doi.org/10.1299/kikaia.77.970.

MLA (9th ed.) Citation

NISHIYAMA, Ituo, and Masaki OMIYA. "Evaluation of Interfacial Strength of Copper Thin Film on Printed Circuit Board with Micro Cutting System." TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A, vol. 77, no. 778, 2011, pp. 970-979, https://doi.org/10.1299/kikaia.77.970.