Sub Threshold Performance Comparison of Doped and H-Cu Carbon Interconnects

• Published in: International Conference on Signal Processing and Communication (Online) pp. 911 - 915
• Main Authors: Sidhu, Ramneek, Rai, Mayank Kumar
• Format: Conference Proceeding
• Language: English
• Published: IEEE 20.02.2025
• Subjects: Delays; hybrid interconnects; Integrated circuit interconnections; interconnects; Lithium; Measurement; MFP; MLGNR; Power transmission lines; Resistance; Scattering; Semiconductor process modeling; Signal processing; sub threshold; System-on-chip; X-talk
• ISSN: 2643-444X
• DOI: 10.1109/ICSC64553.2025.10968778

This article focuses on the electrical modelling of the doped and hybrid carbon interconnects that has been implemented by incorporating the scattering effects in the sub threshold domain of operation. Additionally, the circuit's performance in terms of X-talk (crosstalk) has been assessed. This work focuses on detailed comparison of electrical performance of both the hybrid-Copper-Carbon/H-Cu Carbon and lithium (Li) doping based graphene nanoribbon (MLGNR) interconnects in the context of dynamic as well as functional X-talk at sub threshold operating regions employing transmission line (TL) modeling. The grain size impact on copper (Cu) resistivity and different scatterings on the combined mean free path (MFP) influencing the resulting resistance have been demonstrated in the modeling of H-Cu Carbon interconnects. The effectiveness of hybrid interconnects, particularly H-Cu-Carbon interconnects, is ensured by a thorough examination of the normalized X-talk caused delay (dynamic X-talk), the time-duration (functional X-talk) and the normalized +ve peaks.