APA (7th ed.) Citation

Sidhu, R., & Rai, M. K. (2025, February 20). Sub Threshold Performance Comparison of Doped and H-Cu Carbon Interconnects. International Conference on Signal Processing and Communication (Online), 911-915. https://doi.org/10.1109/ICSC64553.2025.10968778

Chicago Style (17th ed.) Citation

Sidhu, Ramneek, and Mayank Kumar Rai. "Sub Threshold Performance Comparison of Doped and H-Cu Carbon Interconnects." International Conference on Signal Processing and Communication (Online) 20 Feb. 2025: 911-915. https://doi.org/10.1109/ICSC64553.2025.10968778.

MLA (9th ed.) Citation

Sidhu, Ramneek, and Mayank Kumar Rai. "Sub Threshold Performance Comparison of Doped and H-Cu Carbon Interconnects." International Conference on Signal Processing and Communication (Online), 20 Feb. 2025, pp. 911-915, https://doi.org/10.1109/ICSC64553.2025.10968778.