Analysis and Design of Broadband Transitions from Microstrip-to-CV-WSIW for mm-Wave Applications
The concept of the corrugated via-wall substrate-integrated waveguide (CV-WSIW) reported by the same authors earlier has now been extended to the mm-wave frequency range, and the transitions for this category of SIWs from microstrip line (ML) are presented in this work. A new design of enhanced CV-W...
Saved in:
Published in | IEEE International Symposium on Circuits and Systems proceedings pp. 1 - 5 |
---|---|
Main Authors | , , , |
Format | Conference Proceeding |
Language | English |
Published |
IEEE
25.05.2025
|
Subjects | |
Online Access | Get full text |
ISSN | 2158-1525 |
DOI | 10.1109/ISCAS56072.2025.11043610 |
Cover
Abstract | The concept of the corrugated via-wall substrate-integrated waveguide (CV-WSIW) reported by the same authors earlier has now been extended to the mm-wave frequency range, and the transitions for this category of SIWs from microstrip line (ML) are presented in this work. A new design of enhanced CV-WSIW for 18-40 GHz frequency range is proposed. The design includes a tapered section of the microstrip line and two rows of metallic vias with the gap between them. They are providing a better impedance match and reduced overall loss. The proposed design offers improved performance in terms of broadband, return loss (RL), insertion loss (IL), and total loss (TL). The laboratory prototypes are developed, and the obtained simulation results show a close agreement with the measured results. The experimental results show the minimum RL of 22dB, IL of 0.22-0.42dB, a fractional bandwidth of 75.80%, a figure-of-merit of 967.9, and the TL below 20% for ML/CV-WSIW transition within 18-40GHz range. Three additional ML/CV-WSIW transitions were also designed and tested, so that four tested transitions cover 8-60GHz range; an additional fifth transition was simulated only in 60-140GHz range. |
---|---|
AbstractList | The concept of the corrugated via-wall substrate-integrated waveguide (CV-WSIW) reported by the same authors earlier has now been extended to the mm-wave frequency range, and the transitions for this category of SIWs from microstrip line (ML) are presented in this work. A new design of enhanced CV-WSIW for 18-40 GHz frequency range is proposed. The design includes a tapered section of the microstrip line and two rows of metallic vias with the gap between them. They are providing a better impedance match and reduced overall loss. The proposed design offers improved performance in terms of broadband, return loss (RL), insertion loss (IL), and total loss (TL). The laboratory prototypes are developed, and the obtained simulation results show a close agreement with the measured results. The experimental results show the minimum RL of 22dB, IL of 0.22-0.42dB, a fractional bandwidth of 75.80%, a figure-of-merit of 967.9, and the TL below 20% for ML/CV-WSIW transition within 18-40GHz range. Three additional ML/CV-WSIW transitions were also designed and tested, so that four tested transitions cover 8-60GHz range; an additional fifth transition was simulated only in 60-140GHz range. |
Author | Filanovsky, Igor M Moez, Kambiz Patnaik, Amalendu Nayak, Anil Kumar |
Author_xml | – sequence: 1 givenname: Anil Kumar surname: Nayak fullname: Nayak, Anil Kumar email: anayak@ieee.org organization: University of Alberta,iCAS Laboratory,Dept. of Electrical and Computer Engg,Canada – sequence: 2 givenname: Igor M surname: Filanovsky fullname: Filanovsky, Igor M email: ifilanov@ualberta.ca organization: University of Alberta,iCAS Laboratory,Dept. of Electrical and Computer Engg,Canada – sequence: 3 givenname: Kambiz surname: Moez fullname: Moez, Kambiz email: kambiz@ualberta.ca organization: University of Alberta,iCAS Laboratory,Dept. of Electrical and Computer Engg,Canada – sequence: 4 givenname: Amalendu surname: Patnaik fullname: Patnaik, Amalendu email: amalendu.patnaik@ece.iitr.ac.in organization: Indian Institute of Technology Roorkee,Advanced Microwave Laboratory,Dept. of Electronics and Communication Engg,Roorkee,India |
BookMark | eNo1kMtKAzEYRqMo2Na-gYu8QOqf-2Q5jlYLFRctdlkzMxmJdJIhGYS-vdbL6sCB7yy-KboIMTiEMIUFpWBuV5uq3EgFmi0YMHmSgisKZ2hutCm4BC5VweEcTRiVBaGSySs0zfkDgAEoNkFvZbCHY_YZ29Die5f9e8Cxw3cp2rY-uW2yIfvRx5Bxl2KPn32TYh6TH8gYSfVKdpvVDncx4b4nO_vpcDkMB9_Yn801uuzsIbv5H2dou3zYVk9k_fK4qso18YaPhJmGSiVa2ZgGrONMUspEoQ2jQnBZmK4B02mA2lioRc20rq0xWrXfFErzGbr5zXrn3H5IvrfpuP8_hH8Bdd9WjQ |
ContentType | Conference Proceeding |
DBID | 6IE 6IH CBEJK RIE RIO |
DOI | 10.1109/ISCAS56072.2025.11043610 |
DatabaseName | IEEE Electronic Library (IEL) Conference Proceedings IEEE Proceedings Order Plan (POP) 1998-present by volume IEEE Xplore All Conference Proceedings IEEE Electronic Library (IEL) IEEE Proceedings Order Plans (POP) 1998-present |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: RIE name: IEEE Electronic Library (IEL) url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/ sourceTypes: Publisher |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Engineering |
EISBN | 9798350356830 |
EISSN | 2158-1525 |
EndPage | 5 |
ExternalDocumentID | 11043610 |
Genre | orig-research |
GroupedDBID | -~X 6IE 6IF 6IH 6IK 6IL 6IM 6IN AAJGR AAWTH ABLEC ACGFS ADZIZ ALMA_UNASSIGNED_HOLDINGS BEFXN BFFAM BGNUA BKEBE BPEOZ CBEJK CHZPO IEGSK IJVOP IPLJI M43 OCL RIE RIL RIO |
ID | FETCH-LOGICAL-i93t-29c1564d5c9c0ae325112487921443589fc09f700b9a0b4b277ba9976d7ba4673 |
IEDL.DBID | RIE |
IngestDate | Wed Aug 27 01:38:45 EDT 2025 |
IsPeerReviewed | false |
IsScholarly | true |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-LOGICAL-i93t-29c1564d5c9c0ae325112487921443589fc09f700b9a0b4b277ba9976d7ba4673 |
PageCount | 5 |
ParticipantIDs | ieee_primary_11043610 |
PublicationCentury | 2000 |
PublicationDate | 2025-May-25 |
PublicationDateYYYYMMDD | 2025-05-25 |
PublicationDate_xml | – month: 05 year: 2025 text: 2025-May-25 day: 25 |
PublicationDecade | 2020 |
PublicationTitle | IEEE International Symposium on Circuits and Systems proceedings |
PublicationTitleAbbrev | ISCAS |
PublicationYear | 2025 |
Publisher | IEEE |
Publisher_xml | – name: IEEE |
SSID | ssj0020062 |
Score | 2.2930171 |
Snippet | The concept of the corrugated via-wall substrate-integrated waveguide (CV-WSIW) reported by the same authors earlier has now been extended to the mm-wave... |
SourceID | ieee |
SourceType | Publisher |
StartPage | 1 |
SubjectTerms | Bandwidth Broadband Broadband communication Circuits and systems CV-WSIW Figure-of-merit Impedance matching Insertion loss Microstrip Prototypes Simulation SIW Substrates Total loss Waveguide transitions |
Title | Analysis and Design of Broadband Transitions from Microstrip-to-CV-WSIW for mm-Wave Applications |
URI | https://ieeexplore.ieee.org/document/11043610 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV3PS8MwFA66k178NfE3OXhNF9NmbY5jOjZhQ9h0u80kfQGRtUM6D_715rWrTkHw1BIoKUnJ917f932PkGtpQ5DOAVMuQVNt4EyZxDLjw2dIPOA6jXrn4ajdf4zuZ3K2FquXWhgAKMlnEOBtWctPc7vCX2UtD1VR2EZB1bb_ziqx1ld2hWrAmqrDVWsw7nbGHs5jVFsJGdTP_uiiUoJIb4-M6ukr7shrsCpMYD9-OTP--_32SfNbr0cfvpDogGxBdkh2N6wGj8hz7T5CdZbS25K3QXNHfRquU4NjJWpVBC6KohM6RK4etvVYsiJn3Sc2HQ-m1Ae5dLFgU_0OtLNR_W6SSe9u0u2zdXcF9qLCggll0ScmlVZZriHEVEP47EWhh1ooE-UsVy7m3CjNTWREHButfPCS-qs_XcNj0sjyDE4I5dzdgOaRs2CjmCdKJ5GwsWnH1mMkF6ekiWs1X1b-GfN6mc7-GD8nO7hlWKMX8oI0ircVXHroL8xVueWfNqes3A |
linkProvider | IEEE |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV3PS8MwFA4yD-rFXxN_m4PXdLFt1uY4pmPTbQibbreZpC8gsnVI58G_3rx2nVMQPKUECiGBfO_lfd_3CLkWJgBhLTBpYzTVBs6kjg3TLnyG2AGuVah37vXr7afwfizGS7F6roUBgJx8Bh5-5rX8JDULfCqrOagKgzoKqjYd8IeikGut8ivUA5ZkHS5rnUGzMXCAHqHeyhde-fePPio5jLR2Sb9cQMEeefMWmfbM5y9vxn-vcI9UvxV79HGFRftkA2YHZGfNbPCQvJT-I1TNEnqbMzdoaqlLxFWicS7HrYLCRVF2QnvI1sPGHnOWpaz5zEaDzoi6MJdOp2ykPoA21urfVTJs3Q2bbbbsr8BeZZAxXxp0ikmEkYYrCDDZ8F3-ItFFLRCxtIZLG3GupeI61H4UaSVd-JK40d2vwRGpzNIZHBPKub0BxUNrwIQRj6WKQ99Euh4Zh5LcPyFV3KvJvHDQmJTbdPrH_BXZag973Um30384I9t4fFix98U5qWTvC7hwgUCmL_Pj_wJ1ArAp |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=proceeding&rft.title=IEEE+International+Symposium+on+Circuits+and+Systems+proceedings&rft.atitle=Analysis+and+Design+of+Broadband+Transitions+from+Microstrip-to-CV-WSIW+for+mm-Wave+Applications&rft.au=Nayak%2C+Anil+Kumar&rft.au=Filanovsky%2C+Igor+M&rft.au=Moez%2C+Kambiz&rft.au=Patnaik%2C+Amalendu&rft.date=2025-05-25&rft.pub=IEEE&rft.eissn=2158-1525&rft.spage=1&rft.epage=5&rft_id=info:doi/10.1109%2FISCAS56072.2025.11043610&rft.externalDocID=11043610 |