APA (7th ed.) Citation

Xu, L., & Pang, J. (2006). Combined thermal and electromigration exposure effect on SnAgCu BGA solder joint reliability. 56th Electronic Components and Technology Conference 2006, 6 pp.. https://doi.org/10.1109/ECTC.2006.1645799

Chicago Style (17th ed.) Citation

Xu, Luhua, and J.H.L Pang. "Combined Thermal and Electromigration Exposure Effect on SnAgCu BGA Solder Joint Reliability." 56th Electronic Components and Technology Conference 2006 2006: 6 pp.. https://doi.org/10.1109/ECTC.2006.1645799.

MLA (9th ed.) Citation

Xu, Luhua, and J.H.L Pang. "Combined Thermal and Electromigration Exposure Effect on SnAgCu BGA Solder Joint Reliability." 56th Electronic Components and Technology Conference 2006, 2006, p. 6 pp., https://doi.org/10.1109/ECTC.2006.1645799.