Determination of Mechanical Properties of Differently Oriented ß-Tin Crystals in Small Solder Joints and Small Tensile Specimens using EBSD and Nano Hardness Measurements

• Published in: 2007 9th Electronics Packaging Technology Conference pp. 356 - 359
• Main Authors: Villain, J., Corradi, U., Weippert, Chr, Klima, S., Meeh, M., Golling, S.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.12.2007
• Subjects: Copper alloys; Crystals; Environmentally friendly manufacturing techniques; Lead; Mechanical factors; Mechanical variables measurement; Printed circuits; Soldering; Testing; Tin alloys

In modern electronics solder joints are mostly composed of a lead-free solder alloy and interfaces of tin, nickel/gold or copper at the component and the circuit board side. Mostly SAC (SnAgCu) - alloys will be used in electronic products with high tin content. In the course of design and developmen...