Determination of Mechanical Properties of Differently Oriented ß-Tin Crystals in Small Solder Joints and Small Tensile Specimens using EBSD and Nano Hardness Measurements
In modern electronics solder joints are mostly composed of a lead-free solder alloy and interfaces of tin, nickel/gold or copper at the component and the circuit board side. Mostly SAC (SnAgCu) - alloys will be used in electronic products with high tin content. In the course of design and developmen...
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Published in | 2007 9th Electronics Packaging Technology Conference pp. 356 - 359 |
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Main Authors | , , , , , |
Format | Conference Proceeding |
Language | English |
Published |
IEEE
01.12.2007
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Subjects | |
Online Access | Get full text |
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