Liao, M. C., Huang, P. S., Huang, T. C., & Tsai, M. Y. (2014, October). Mechanics of back-plate reinforced structure for server CPU assembly under mechanical loading: Measurements and simulation. Proceedings of technical papers (International Microsystems, Packaging, Assembly, and Circuits Technology Conference. Print), 138-140. https://doi.org/10.1109/IMPACT.2014.7048408
Chicago Style (17th ed.) CitationLiao, M. C., P. S. Huang, T. C. Huang, and M. Y. Tsai. "Mechanics of Back-plate Reinforced Structure for Server CPU Assembly Under Mechanical Loading: Measurements and Simulation." Proceedings of Technical Papers (International Microsystems, Packaging, Assembly, and Circuits Technology Conference. Print) Oct. 2014: 138-140. https://doi.org/10.1109/IMPACT.2014.7048408.
MLA (9th ed.) CitationLiao, M. C., et al. "Mechanics of Back-plate Reinforced Structure for Server CPU Assembly Under Mechanical Loading: Measurements and Simulation." Proceedings of Technical Papers (International Microsystems, Packaging, Assembly, and Circuits Technology Conference. Print), Oct. 2014, pp. 138-140, https://doi.org/10.1109/IMPACT.2014.7048408.