FPGA based Ultrasonic thickness measuring device

• Published in: 2018 International Conference on Advances in Computing, Communications and Informatics (ICACCI) pp. 779 - 784
• Main Authors: Shrisha, M R, Chakraborty, Nibir, Mahapatra, D Roy, Sunkara, Sowmya
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.09.2018
• Subjects: Acoustics; ADC Module; Clocks; Contact Transducer; DAC Module; Field programmable gate arrays; Graphical user interfaces; NDT; Spartan XC6SLX9 FPGA; Testing; Thickness measurement; Ultrasonic testing; Ultrasonic variables measurement
• DOI: 10.1109/ICACCI.2018.8554446

This paper aims at the development of ultrasound based thickness measurement device. A Spartan 6 FPGA from Xilinx has been used in the hardware design along with external parallel Analog to Digital and digital to Analog converter. The device is interfaced with a PC or laptop through USB cable. A measurement and control software is developed using MATLAB for conceptual level and final Graphical User Interface has been developed in. NET to transfer different user defined control parameters to the hardware and receive the captured signal. Ultrasonic probes are used to generate and receive physical sound wave in pulse-echo mode. Time of flight (ToF) based calculations are used for deriving the subject dimension.