Liquid immersion cooling technology with natural convection in data center

We proposed a liquid immersion cooling technology with natural convection for high power server boards used in data centers with high cooling-efficiency. The cooling performance was evaluated by CFD simulation and actual experiments. As the refrigerants, several non-conductive, thermally and chemica...

Full description

Saved in:
Bibliographic Details
Published in2017 IEEE 6th International Conference on Cloud Networking (CloudNet) pp. 1 - 7
Main Authors Matsuoka, Morito, Matsuda, Kazuhiro, Kubo, Hideo
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.09.2017
Subjects
Online AccessGet full text
DOI10.1109/CloudNet.2017.8071539

Cover

Abstract We proposed a liquid immersion cooling technology with natural convection for high power server boards used in data centers with high cooling-efficiency. The cooling performance was evaluated by CFD simulation and actual experiments. As the refrigerants, several non-conductive, thermally and chemically stable fluids were applied, including silicone oil, soybean oil, and perfluorocarbon structured liquids. The CPU temperature in the refrigerant monotonically decreases with the Rayleigh numbers of the refrigerant. The smoother refrigerant is better for cooling the high power CPU. The changes in any CPU task and any slot-removal give limited cooling effects to other slots and other CPUs. These are quite useful features for stable operation of servers in data center. As a result, this proposed technology with natural convection exhibits promising potential for low energy and space-saving board cooling which demonstrates a Power Usage Efficiency (PUE) below 1.04.
AbstractList We proposed a liquid immersion cooling technology with natural convection for high power server boards used in data centers with high cooling-efficiency. The cooling performance was evaluated by CFD simulation and actual experiments. As the refrigerants, several non-conductive, thermally and chemically stable fluids were applied, including silicone oil, soybean oil, and perfluorocarbon structured liquids. The CPU temperature in the refrigerant monotonically decreases with the Rayleigh numbers of the refrigerant. The smoother refrigerant is better for cooling the high power CPU. The changes in any CPU task and any slot-removal give limited cooling effects to other slots and other CPUs. These are quite useful features for stable operation of servers in data center. As a result, this proposed technology with natural convection exhibits promising potential for low energy and space-saving board cooling which demonstrates a Power Usage Efficiency (PUE) below 1.04.
Author Matsuoka, Morito
Matsuda, Kazuhiro
Kubo, Hideo
Author_xml – sequence: 1
  givenname: Morito
  surname: Matsuoka
  fullname: Matsuoka, Morito
  organization: Cybernedia Center, Osaka Univ., Toyonaka, Japan
– sequence: 2
  givenname: Kazuhiro
  surname: Matsuda
  fullname: Matsuda, Kazuhiro
  organization: Cybernedia Center, Osaka Univ., Toyonaka, Japan
– sequence: 3
  givenname: Hideo
  surname: Kubo
  fullname: Kubo, Hideo
  organization: Electr. & Mech. Eng. Dev. Div., Fujitsu Ltd., Kawasaki, Japan
BookMark eNotj81KAzEURiPoQmufQIS8wNSbZNJMljL4y6Cb7stN5qYNzCQ6zSh9exW7-hbncOC7YucpJ2LsVsBKCLB37ZDn_o3KSoIwqwaM0MqesaU1jdBgoQa5FpfstYufc-x5HEeaDjEn7nMeYtrxQn6f8pB3R_4dy54nLPOEwy9PX-TLnxoT77Eg95QKTdfsIuBwoOVpF2zz-LBpn6vu_emlve-qaKFUjXRBrp2zZBCDaUBIEXxvVKgVknUBHUhoag3oUWqpapJktfJUaxdIqQW7-c9GItp-THHE6bg9HVQ_m91NaA
ContentType Conference Proceeding
DBID 6IE
6IL
CBEJK
RIE
RIL
DOI 10.1109/CloudNet.2017.8071539
DatabaseName IEEE Electronic Library (IEL) Conference Proceedings
Accès UT - IEEE Xplore POP ALL
IEEE Xplore All Conference Proceedings
IEEE Xplore Digital Libary (IEL)
IEEE Proceedings Order Plans (POP All) 1998-Present
DatabaseTitleList
Database_xml – sequence: 1
  dbid: RIE
  name: IEEE Electronic Library (IEL)
  url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/
  sourceTypes: Publisher
DeliveryMethod fulltext_linktorsrc
EISBN 9781509040261
1509040269
EndPage 7
ExternalDocumentID 8071539
Genre orig-research
GroupedDBID 6IE
6IL
CBEJK
RIE
RIL
ID FETCH-LOGICAL-i90t-82bf26bb9e7aaf780121fcd73f43ae9bfab0208450aca25234e2e953ce45bfe33
IEDL.DBID RIE
IngestDate Thu Jun 29 18:37:13 EDT 2023
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-i90t-82bf26bb9e7aaf780121fcd73f43ae9bfab0208450aca25234e2e953ce45bfe33
PageCount 7
ParticipantIDs ieee_primary_8071539
PublicationCentury 2000
PublicationDate 2017-Sept.
PublicationDateYYYYMMDD 2017-09-01
PublicationDate_xml – month: 09
  year: 2017
  text: 2017-Sept.
PublicationDecade 2010
PublicationTitle 2017 IEEE 6th International Conference on Cloud Networking (CloudNet)
PublicationTitleAbbrev CloudNet
PublicationYear 2017
Publisher IEEE
Publisher_xml – name: IEEE
Score 1.8654938
Snippet We proposed a liquid immersion cooling technology with natural convection for high power server boards used in data centers with high cooling-efficiency. The...
SourceID ieee
SourceType Publisher
StartPage 1
SubjectTerms cloud computing
computational fluid dynamics
Convection
data center
Heating systems
liquid immersion
Liquids
natural convection
power usage effectiveness
Refrigerants
Servers
Title Liquid immersion cooling technology with natural convection in data center
URI https://ieeexplore.ieee.org/document/8071539
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV3PS8MwFA7bTp5UNvE3OXi0Xdska3MejjF0eJiw28iPFymOTqW9-Nebl9aJ4sFbCYWE9wIf7-X73kfITSF16ixPIinQwowXNpK6SCNfGljGrVPGBZbvcjJ_4ou1WPfI7V4LAwCBfAYxfoa3fLszDbbKxoXHQ8Fkn_T9NWu1Wp0oJ03keLrdNXYJSJBM87j794dpSsCM2SF5-NqtpYq8xE2tY_PxaxDjf49zREbf6jz6uMedY9KDakgW9-VbU1pahka0DzY1O_Tjeab1vnlOselKwyhPtaWBbx5UDbSsKDJFKTI14X1EVrO71XQedT4JUSmTOioy7bKJ1hJypVyOkJM6Y3PmOFMgtVManTi5SJRRmS88OWQgBTPAhXbA2AkZVLsKTgkVuVRmorjCyskK46GKMRz4o32qmVFnZIhh2Ly2kzA2XQTO_16-IAeYipaRdUkG9XsDVx7Ca30dcvcJcx6gSA
linkProvider IEEE
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV09T8MwED2VMsAEqEV844GRpElsN_FcgUppK4Yidav8iSKqBKpk4ddjO6EIxMBmWZZs3Q1Pd37vHsBNxkRsFIkCRp2FGclUwEQWB7Y0UJgow6XxLN_5cPxMJku67MDtVgujtfbkMx26pf_LV6WsXatskFk8pJjtwK7FfUIbtVYry4kjNhity1rNtaNIxmnYnv5hm-JR4_4AZl_3NWSR17CuRCg_fo1i_O-DDqH_rc9DT1vkOYKOLnowmebvda5Q7lvRNtxIls6R5wVV2_Y5cm1X5Id58jXyjHOva0B5gRxXFDmupt70YXF_txiNg9YpIchZVAVZIkwyFILplHOTOtCJjVQpNgRzzYThwnlxEhpxyRNbehKdaEax1IQKozE-hm5RFvoEEE0Zl0NOuKudFJUWrDB2I3-ETTaW_BR6Lgyrt2YWxqqNwNnf29ewN17Mpqvpw_zxHPZdWhp-1gV0q02tLy2gV-LK5_ETA9ajlQ
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=proceeding&rft.title=2017+IEEE+6th+International+Conference+on+Cloud+Networking+%28CloudNet%29&rft.atitle=Liquid+immersion+cooling+technology+with+natural+convection+in+data+center&rft.au=Matsuoka%2C+Morito&rft.au=Matsuda%2C+Kazuhiro&rft.au=Kubo%2C+Hideo&rft.date=2017-09-01&rft.pub=IEEE&rft.spage=1&rft.epage=7&rft_id=info:doi/10.1109%2FCloudNet.2017.8071539&rft.externalDocID=8071539