Experimental Analysis of High Temperature PEEK Materials on 3D Printing Test

• Published in: International Conference on Measuring Technology and Mechatronics Automation (Print) pp. 13 - 16
• Main Authors: Sun Xiaoyong, Cao Liangcheng, Ma Honglin, Gao Peng, Bai Zhanwei, Li Cheng
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.01.2017
• Subjects: 3D printing; Filling; Forming precision; Mechanical factors; PEEK; Programmable logic arrays; Temperature; Temperature effect; Temperature measurement; Three-dimensional printing

As a kind of semi crystalline thermoplastic engineering plastics, Polyetheretherketone (PEEK) has excellent mechanical properties and chemical stability. Aiming at the high temperature properties of PEEK, test and analysis of PEEK fused 3D printing performance was carried out by the fused deposition...