Experimental Analysis of High Temperature PEEK Materials on 3D Printing Test - Sun Xiaoyong; Cao Liangcheng; Ma Honglin; Gao Peng; Bai Zhanwei; Li Cheng (International Conference on Measuring Technology and Mechatronics Automation (Print), 2017)
Keywords: 3D printing; Filling; Forming precision; Mechanical factors; PEEK; Programmable logic arrays; Temperature; Temperature effect; Temperature measurement; Three-dimensional printing