Current carry capacity characterization for high performance system on chip packages

• Published in: 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) pp. 1 - 3
• Main Authors: Ng Hui Ying, Wong Wui Weng
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.12.2015
• Subjects: Current distribution; Electronics packaging; Heating; Pins; Power demand; System-on-chip; Temperature distribution

System on Chip (SoC) technology is rapidly evolved across high power workstations to low power tablets. As complex SoC further integrates several hardware functionalities, the system-level on-chip architecture is emerging as a significant source of power consumption. Improving current carry capacity...