APA (7th ed.) Citation

Song, F., & Lee, S. (2006). Corrosion of Sn-Ag-Cu lead-free solders and the corresponding effects on board level solder joint reliability. 56th Electronic Components and Technology Conference 2006, 8 pp.. https://doi.org/10.1109/ECTC.2006.1645761

Chicago Style (17th ed.) Citation

Song, Fubin, and S.W.R Lee. "Corrosion of Sn-Ag-Cu Lead-free Solders and the Corresponding Effects on Board Level Solder Joint Reliability." 56th Electronic Components and Technology Conference 2006 2006: 8 pp.. https://doi.org/10.1109/ECTC.2006.1645761.

MLA (9th ed.) Citation

Song, Fubin, and S.W.R Lee. "Corrosion of Sn-Ag-Cu Lead-free Solders and the Corresponding Effects on Board Level Solder Joint Reliability." 56th Electronic Components and Technology Conference 2006, 2006, p. 8 pp., https://doi.org/10.1109/ECTC.2006.1645761.