Design of E-plane T-junction dividers using substrate integrated waveguide (SIW)

• Published in: 2014 IEEE 28th Convention of Electrical & Electronics Engineers in Israel (IEEEI) pp. 1 - 4
• Main Authors: Aram, Ido, Garb, Khona, Kastner, Raphael
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.12.2014
• Subjects: Couplings; Dielectrics; E-plane T-junction; Educational institutions; Junctions; magic tee; Microstrip; power amplifiers; Power dividers; SIW; Substrates

Power dividers/combiners are critical building blocks of Solid State Power Amplifiers (SSPA). We propose a novel E-plane power divider with arbitrary splitting ratios, implemented in SIW technology. The divider is realized on standard dual layered PCB substrates, where the required coupling is achie...