Design of E-plane T-junction dividers using substrate integrated waveguide (SIW)
Power dividers/combiners are critical building blocks of Solid State Power Amplifiers (SSPA). We propose a novel E-plane power divider with arbitrary splitting ratios, implemented in SIW technology. The divider is realized on standard dual layered PCB substrates, where the required coupling is achie...
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Published in | 2014 IEEE 28th Convention of Electrical & Electronics Engineers in Israel (IEEEI) pp. 1 - 4 |
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Main Authors | , , |
Format | Conference Proceeding |
Language | English |
Published |
IEEE
01.12.2014
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Subjects | |
Online Access | Get full text |
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Summary: | Power dividers/combiners are critical building blocks of Solid State Power Amplifiers (SSPA). We propose a novel E-plane power divider with arbitrary splitting ratios, implemented in SIW technology. The divider is realized on standard dual layered PCB substrates, where the required coupling is achieved through a slot between the two layers. This unique design can be subject to easy modifications that support arbitrary power split ratios. Both equal and non-equal K-Band power splitter prototypes have been designed, fabricated and tested. Simulation and experiments validate the performance of this very useful building block for future miniature SSPA's. |
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DOI: | 10.1109/EEEI.2014.7005845 |