An approach for failure prediction in H3 TRB-tests

• Published in: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) pp. 1 - 5
• Main Authors: Kolbinger, Elisabeth, Wuest, Felix, Dijk, Marius van, Trampert, Stefan, Lang, Klaus-Dieter
• Format: Conference Proceeding
• Language: English
• Published: IMAPS-Europe 01.09.2019
• Subjects: Absorption; Corrosion; diffusion processes; H3TRB-Test; High-voltage techniques; Humidity; Moisture; Multichip modules; power modules; Reliability

Applications for power modules under harsh environmental conditions have gained importance in recent years, e.g. in offshore wind turbines. One of the critical conditions that leads to failures in these applications is humidity. Therefore, it is important to subject the power electronics to appropri...