Influence of Substrate Temperature and Sulfurization on Sputtered Cu2SnGe(S,Se)3 Thin Films for Solar Cell Application
This work presents the influence of substrate temperature (<inline-formula> <tex-math notation="LaTeX">{T}_{\text{sub}} </tex-math></inline-formula>) and post-sulfurization on compositional, structural, electrical, and optical properties of dual-ion beam sputtering...
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Published in | IEEE transactions on electron devices Vol. 69; no. 5; pp. 2488 - 2493 |
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Main Authors | , , , , , , , |
Format | Journal Article |
Language | English |
Published |
New York
IEEE
01.05.2022
The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subjects | |
Online Access | Get full text |
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Summary: | This work presents the influence of substrate temperature (<inline-formula> <tex-math notation="LaTeX">{T}_{\text{sub}} </tex-math></inline-formula>) and post-sulfurization on compositional, structural, electrical, and optical properties of dual-ion beam sputtering (DIBS)-grown Cu 2 (Sn,Ge)(S,Se) 3 (CTGSSe) thin films grown on a soda-lime glass (SLG) substrate using a single target. Post-sulfurization of CTGSSe thin films is carried out in a quartz tube chemical vapor deposition (CVD) system. X-ray diffraction (XRD) analysis reveals that the crystal structure of CTGSSe thin films is preferentially tetragonal with (112) and (204) lattice planes at <inline-formula> <tex-math notation="LaTeX">2\theta </tex-math></inline-formula> values of 27.3° and 47.3°, respectively. Field-emission scanning electron microscopy (SEM) has emphasized that the high <inline-formula> <tex-math notation="LaTeX">{T}_{\text{sub}} </tex-math></inline-formula> growth resulted in a larger grain size of 87 nm and better thin-film morphology. Spectroscopic ellipsometry (SE) analysis shows the bandgap values of 1.46-1.62 eV by varying <inline-formula> <tex-math notation="LaTeX">{T}_{\text{sub}} </tex-math></inline-formula> from room temperature (RT) to 300 °C. Furthermore, the bandgap widens from 1.56 to 1.64 eV in the CTGSSe thin films due to post-sulfurization. |
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ISSN: | 0018-9383 1557-9646 |
DOI: | 10.1109/TED.2022.3159509 |