High Strain Rate Materials Characterization at Low Test Temperatures for Thermally Aged SAC-Q Solder Alloys

• Published in: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) pp. 1 - 16
• Main Authors: Lall, Pradeep, Yadav, Vikas, Suhling, Jeff, Locker, David
• Format: Conference Proceeding
• Language: English
• Published: IEEE 31.05.2022
• Subjects: Aging; Anand Viscoplastic model; Computational modeling; Data models; High Strain Rate; Low Temperature; Metals; Predictive models; SAC-Q; SAC105; Temperature measurement; Thermomechanical processes

A number of doped SnAgCu alloys have emerged to mitigate the effects of thermal aging on the property deterioration of the interconnects. Much less is known about the performance of alloys at low temperatures simultaneously with high strain rates which may be encountered in harsh environment applica...