Annealing of Al2O3 thin films prepared by atomic layer deposition

Amorphous Al2O3 thin films were deposited on a Si (1 1 1) substrate at 150 deg C in oxygen-rich conditions by atomic layer deposition. Rapid thermal annealing was performed at high temperatures, ranging from 1000 to 1200 deg C, to study the crystallization characteristics of the Al2O3 films. X-ray d...

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Published inJournal of physics. D, Applied physics Vol. 40; no. 12; pp. 3707 - 3713
Main Authors Zhang, L, Jiang, H C, Liu, C, Dong, J W, Chow, P
Format Journal Article
LanguageEnglish
Published Bristol IOP Publishing 21.06.2007
Institute of Physics
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Abstract Amorphous Al2O3 thin films were deposited on a Si (1 1 1) substrate at 150 deg C in oxygen-rich conditions by atomic layer deposition. Rapid thermal annealing was performed at high temperatures, ranging from 1000 to 1200 deg C, to study the crystallization characteristics of the Al2O3 films. X-ray diffraction (XRD), high-resolution transmission electron microscopy (HRTEM), scanning electron microscopy, atomic force microscopy and frequency-dependent capacitance measurements were used to characterize the structural and electrical properties before and after the annealing. It was found that the best crystallization of the Al2O3 film was achieved after annealing at 1150 deg C, corresponding to a minimum of full width at half maximum (FWHM) of the Al2O3 (012) XRD peak and the maximum of surface roughness and the capacitances. This suggests that 1150 deg C is the optimal transition temperature from amorphous to crystalline and to get the best insulating property for Al2O3 thin film. The formation of the SiO2 interfacial layer after annealing has been observed by HRTEM for the annealed sample, accompanied by a decrease in the thickness of Al2O3 films.
AbstractList Amorphous Al2O3 thin films were deposited on a Si (1 1 1) substrate at 150 deg C in oxygen-rich conditions by atomic layer deposition. Rapid thermal annealing was performed at high temperatures, ranging from 1000 to 1200 deg C, to study the crystallization characteristics of the Al2O3 films. X-ray diffraction (XRD), high-resolution transmission electron microscopy (HRTEM), scanning electron microscopy, atomic force microscopy and frequency-dependent capacitance measurements were used to characterize the structural and electrical properties before and after the annealing. It was found that the best crystallization of the Al2O3 film was achieved after annealing at 1150 deg C, corresponding to a minimum of full width at half maximum (FWHM) of the Al2O3 (012) XRD peak and the maximum of surface roughness and the capacitances. This suggests that 1150 deg C is the optimal transition temperature from amorphous to crystalline and to get the best insulating property for Al2O3 thin film. The formation of the SiO2 interfacial layer after annealing has been observed by HRTEM for the annealed sample, accompanied by a decrease in the thickness of Al2O3 films.
Author Zhang, L
Liu, C
Chow, P
Dong, J W
Jiang, H C
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Issue 12
Keywords Atomic force microscopy
Scanning electron microscopy
Frequency dependence
Crystallization
Roughness
XRD
Amorphous state
High temperature
Atomic layer epitaxial growth
Thin films
Rapid thermal annealing
Transmission electron microscopy
Capacitance
Aluminium oxides
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Snippet Amorphous Al2O3 thin films were deposited on a Si (1 1 1) substrate at 150 deg C in oxygen-rich conditions by atomic layer deposition. Rapid thermal annealing...
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SubjectTerms Cross-disciplinary physics: materials science; rheology
Exact sciences and technology
Materials science
Methods of deposition of films and coatings; film growth and epitaxy
Physics
Vapor phase epitaxy; growth from vapor phase
Title Annealing of Al2O3 thin films prepared by atomic layer deposition
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