Underwater flexible shear-stress sensor skins
This paper reports the development of underwater flexible shear-stress sensor skins that enable not only the acquisition of shear-stress distributions on non-planar surfaces but also a reliable packaging scheme. The sensor skin fabrication consists of two steps: the fabrication of shear-stress senso...
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Published in | 17th IEEE International Conference on Micro Electro Mechanical Systems. Maastricht MEMS 2004 Technical Digest pp. 833 - 836 |
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Main Authors | , , , , |
Format | Conference Proceeding |
Language | English |
Published |
Piscataway NJ
IEEE
2004
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Subjects | |
Online Access | Get full text |
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Summary: | This paper reports the development of underwater flexible shear-stress sensor skins that enable not only the acquisition of shear-stress distributions on non-planar surfaces but also a reliable packaging scheme. The sensor skin fabrication consists of two steps: the fabrication of shear-stress sensors on silicon wafers and the fabrication of flexible skins by forming arrays of silicon islands sandwiched by two polyimide layers. The fabricated sensor skin has been packaged on a metal plug and bonding pads were folded to the back side through a slit on the plug. Wire bonding was performed on the back side to improve the reliability and minimize flow interference. The packaged sensor skin has been installed on a water tunnel and successfully tested. |
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ISBN: | 078038265X 9780780382657 |
DOI: | 10.1109/MEMS.2004.1290714 |