Passivation Materials for a Reliable Fine Pitch RDL - Stephane, Moreau; Allouti, Nacima; Ribiere, Celine; Charbonnier, Jean; Bouchu, David; Michel, Jean-Philippe; Buffet, Nicolas; Chausse, Pascal (2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018)
Keywords: 2.5D/3D packaging; Copper; electromigration; high temperature storage test; High-temperature superconductors; Moisture; Passivation; Passivation material; Plastics; polymer; redistribution layer (RDL); Reliability; Resistance