Characterization of micro-bump C4 interconnects for Si-carrier SOP applications - Wright, S.L.; Polastre, R.; Gan, H.; Buchwalter, L.P.; Horton, R.; Andry, P.S.; Sprogis, E.; Patel, C.; Tsang, C.; Knickerbocker, J.; Lloyd, J.R.; Sharma, A.; et al. (56th Electronic Components and Technology Conference 2006, 2006)
Keywords: Ceramics; Contact resistance; Gallium nitride; Packaging; Power system interconnection; Resists; Rivers; Silicon; System testing; Wiring