Chlorine-based dry etching of β-Ga2O3

Reactive ion etching (RIE) and inductively coupled plasma (ICP) etching techniques were used to determine the optimal dry etch conditions for β-Ga2O3. RF power and chamber pressure were examined to study their effects on etch rate and surface roughness for three crystallographic planes, i.e., (100);...

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Bibliographic Details
Published inSemiconductor science and technology Vol. 31; no. 6
Main Authors Hogan, Jack E, Kaun, Stephen W, Ahmadi, Elaheh, Oshima, Yuichi, Speck, James S
Format Journal Article
LanguageEnglish
Published IOP Publishing 14.04.2016
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