Chlorine-based dry etching of β-Ga2O3
Reactive ion etching (RIE) and inductively coupled plasma (ICP) etching techniques were used to determine the optimal dry etch conditions for β-Ga2O3. RF power and chamber pressure were examined to study their effects on etch rate and surface roughness for three crystallographic planes, i.e., (100);...
Saved in:
Published in | Semiconductor science and technology Vol. 31; no. 6 |
---|---|
Main Authors | , , , , |
Format | Journal Article |
Language | English |
Published |
IOP Publishing
14.04.2016
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Be the first to leave a comment!