A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels

• Published in: 2012 4th Electronic System-Integration Technology Conference pp. 1 - 6
• Main Authors: Cauwe, Maarten, Vandecasteele, Bjorn, De Baets, Johan, van den Brand, Jeroen, Kusters, Roel, Sridhar, Ashok
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.09.2012
• Subjects: Copper; Costs; Electrical resistance measurement; Failure analysis; Heating systems; Integrated circuit interconnections; Lamination; Microassembly; Semiconductor device measurement; Stress
• ISBN: 1467346454; 9781467346450
• DOI: 10.1109/ESTC.2012.6542155

Expanding the current smart packaging solutions to individual products requires improvement for several of the following properties: cost, thickness, weight, flexibility, conformability, transparency, and even stretchability. This paper focusses on an embedding technology that targets the first four properties, with an emphasis on cost reduction. The progress on the development work for this foil-based embedding is reported, along with a detailed failure analysis of the process flow. A functional demonstrator is realized in the form of a smart sensing label, including an embedded micro controller. Practical and technological shortcomings of the current technology are used as a starting point for proposing an improved embedding technology based on low-cost plastic materials. The first developments for lamination and via interconnection are described.