Analysis of process dependent mechanical properties of sintered copper nanoparticle pillars for the plating-free bumping by finite element method

• Published in: InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems pp. 1 - 8
• Main Authors: Kohara, Sayuri, Aoki, Toyohiro, Marushima, Chinami, Taylor, Christine, Sueoka, Kuniaki, Hisada, Takashi
• Format: Conference Proceeding
• Language: English; Japanese
• Published: IEEE 31.05.2022
• Subjects: Cu nanoparticles; Data models; FEM; Finite element analysis; IMS; Mechanical factors; nanoindentation; Nanoparticles; Sintering; Temperature; Temperature dependence

Previous studies of sintered copper nanoparticles used in the plating-free bumping by injection molded solder (IMS) have shown that their microstructural features depend on the sintering conditions such as temperature and gas atmosphere. The other study has shown that the elastic modulus and yield o...