Analysis of process dependent mechanical properties of sintered copper nanoparticle pillars for the plating-free bumping by finite element method - Kohara, Sayuri; Aoki, Toyohiro; Marushima, Chinami; Taylor, Christine; Sueoka, Kuniaki; Hisada, Takashi (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2022)
Keywords: Cu nanoparticles; Data models; FEM; Finite element analysis; IMS; Mechanical factors; nanoindentation; Nanoparticles; Sintering; Temperature; Temperature dependence