Kohara, S., Aoki, T., Marushima, C., Taylor, C., Sueoka, K., & Hisada, T. (2022, May 31). Analysis of process dependent mechanical properties of sintered copper nanoparticle pillars for the plating-free bumping by finite element method. InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 1-8. https://doi.org/10.1109/iTherm54085.2022.9899672
Chicago Style (17th ed.) CitationKohara, Sayuri, Toyohiro Aoki, Chinami Marushima, Christine Taylor, Kuniaki Sueoka, and Takashi Hisada. "Analysis of Process Dependent Mechanical Properties of Sintered Copper Nanoparticle Pillars for the Plating-free Bumping by Finite Element Method." InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems 31 May. 2022: 1-8. https://doi.org/10.1109/iTherm54085.2022.9899672.
MLA (9th ed.) CitationKohara, Sayuri, et al. "Analysis of Process Dependent Mechanical Properties of Sintered Copper Nanoparticle Pillars for the Plating-free Bumping by Finite Element Method." InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 31 May. 2022, pp. 1-8, https://doi.org/10.1109/iTherm54085.2022.9899672.