Effect of Underfill Formulation on Large-Die, Flip-Chip Organic Package Reliability: A Systematic Study on Compositional and Assembly Process Variations

• Published in: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) pp. 729 - 736
• Main Authors: Paquet, Marie-Claude, Dufort, Catherine, Lombardi, Thomas E., Sinha, Tuhin, Hasegawa, Masahiro, Okoshi, Kodai, Kohara, Kazuyuki
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.05.2016
• Subjects: Adhesives; Bond and Assembly; Chip-Package Interaction (CPI); Delamination; Finite element analysis; Flip-Chip; Flip-chip devices; Material properties; Package Reliability; Reliability; Stress; Underfill

Selection of appropriate underfills (or encapsulants) for flip-chip packages is critical to their reliability. In this research article, we present a comprehensive study geared towards the development of such materials. Several underfill formulations were developed based on the target material prope...