APA (7th ed.) Citation

Lim, D. K., Vempaty, V. R. S. P., Sim, W. H., & Singh, H. V. (2023, December 5). Impact of Wafer Pre-thin Thickness on Stealth Dicing Performance. 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 701-704. https://doi.org/10.1109/EPTC59621.2023.10457881

Chicago Style (17th ed.) Citation

Lim, Dao Kun, Venkata Rama Satya Pradeep Vempaty, Wen How Sim, and Harjashan Veer Singh. "Impact of Wafer Pre-thin Thickness on Stealth Dicing Performance." 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) 5 Dec. 2023: 701-704. https://doi.org/10.1109/EPTC59621.2023.10457881.

MLA (9th ed.) Citation

Lim, Dao Kun, et al. "Impact of Wafer Pre-thin Thickness on Stealth Dicing Performance." 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 5 Dec. 2023, pp. 701-704, https://doi.org/10.1109/EPTC59621.2023.10457881.