The Effect of Filler Mass Fraction on The Physical Properties of Conductive Silver Adhesives

• Published in: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) pp. 459 - 463
• Main Authors: Yu, Ziniu, Lv, Weishan, Zhu, Fulong
• Format: Conference Proceeding
• Language: English
• Published: IEEE 05.12.2023
• Subjects: Conductivity; Finite element analysis; Mechanical factors; Silver; Solid modeling; Thermal resistance; Young's modulus
• DOI: 10.1109/EPTC59621.2023.10457922

About investigating the effect of filler mass fraction on the physical properties of electrically conductive adhesives (ECAs), most studies are based on experiments. This paper proposes a conductive silver adhesive and uses the finite element method to analyze the influence of different silver filler mass fractions on the physical property of ECAs. The research results show that when the mass fraction of the filler is low, there is no significant improvement in the conductivity, thermal conductivity, and Young's modulus of ECAs. When the penetration threshold is reached, the volume resistivity of ECA undergoes a sudden change, and there is no significant change in the volume resistivity as the mass fraction increases. In addition, for the conduction mechanism, the conductivity and thermal conductivity of ECAs mainly rely on contact conduction between filler particles. Investigating the effect of filler mass fraction is of great significance in reducing the design and manufacturing costs of ECAs.