APA (7th ed.) Citation

Khurana, G., & Panchenko, I. (2023, December 5). Improvement in Wafer-to-Wafer Hybrid Bonding Using Optimized Chemical Mechanical Planarization Process for Cu Dishing. 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 373-380. https://doi.org/10.1109/EPTC59621.2023.10457774

Chicago Style (17th ed.) Citation

Khurana, Gaurav, and Iuliana Panchenko. "Improvement in Wafer-to-Wafer Hybrid Bonding Using Optimized Chemical Mechanical Planarization Process for Cu Dishing." 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) 5 Dec. 2023: 373-380. https://doi.org/10.1109/EPTC59621.2023.10457774.

MLA (9th ed.) Citation

Khurana, Gaurav, and Iuliana Panchenko. "Improvement in Wafer-to-Wafer Hybrid Bonding Using Optimized Chemical Mechanical Planarization Process for Cu Dishing." 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 5 Dec. 2023, pp. 373-380, https://doi.org/10.1109/EPTC59621.2023.10457774.