Reliability of STT-MRAM for various embedded applications

Owing to tunability of MTJ stack characteristics based on perpendicular magnetic anisotropy control via sophisticated magnetic material engineering, STT-MRAM can meet a wide range of product specifications for various applications: 1) flash-type applications such as microcontroller and AI inferencin...

Full description

Saved in:
Bibliographic Details
Published in2021 IEEE International Reliability Physics Symposium (IRPS) pp. 1 - 5
Main Authors Han, S. H., Lee, J. H., Suh, K. S., Nam, K. T., Jeong, D. E., Oh, S. C., Hwang, S. H., Ji, Y., Lee, K., Song, Y. J., Hong, Y. G., Jeong, G. T.
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.03.2021
Subjects
Online AccessGet full text

Cover

Loading…
Abstract Owing to tunability of MTJ stack characteristics based on perpendicular magnetic anisotropy control via sophisticated magnetic material engineering, STT-MRAM can meet a wide range of product specifications for various applications: 1) flash-type applications such as microcontroller and AI inferencing device and 2) SRAM-type applications such as frame buffer memory. However each application has different reliability challenges. In this paper, we discuss the reliability requirements for Flash-type and SRAM-type STT-MRAM, verifying superb reliability of highly tunable STT-MRAM technology.
AbstractList Owing to tunability of MTJ stack characteristics based on perpendicular magnetic anisotropy control via sophisticated magnetic material engineering, STT-MRAM can meet a wide range of product specifications for various applications: 1) flash-type applications such as microcontroller and AI inferencing device and 2) SRAM-type applications such as frame buffer memory. However each application has different reliability challenges. In this paper, we discuss the reliability requirements for Flash-type and SRAM-type STT-MRAM, verifying superb reliability of highly tunable STT-MRAM technology.
Author Jeong, D. E.
Song, Y. J.
Hwang, S. H.
Lee, K.
Han, S. H.
Suh, K. S.
Ji, Y.
Jeong, G. T.
Lee, J. H.
Nam, K. T.
Hong, Y. G.
Oh, S. C.
Author_xml – sequence: 1
  givenname: S. H.
  surname: Han
  fullname: Han, S. H.
  organization: Foundry Business, Samsung Electronics Co,Yongin-City,Gyeonggi-Do,Korea,446-711
– sequence: 2
  givenname: J. H.
  surname: Lee
  fullname: Lee, J. H.
  organization: R&D Center, Samsung Electronics,Hwasung,Korea
– sequence: 3
  givenname: K. S.
  surname: Suh
  fullname: Suh, K. S.
  organization: Foundry Business, Samsung Electronics Co,Yongin-City,Gyeonggi-Do,Korea,446-711
– sequence: 4
  givenname: K. T.
  surname: Nam
  fullname: Nam, K. T.
  organization: Foundry Business, Samsung Electronics Co,Yongin-City,Gyeonggi-Do,Korea,446-711
– sequence: 5
  givenname: D. E.
  surname: Jeong
  fullname: Jeong, D. E.
  organization: R&D Center, Samsung Electronics,Hwasung,Korea
– sequence: 6
  givenname: S. C.
  surname: Oh
  fullname: Oh, S. C.
  organization: R&D Center, Samsung Electronics,Hwasung,Korea
– sequence: 7
  givenname: S. H.
  surname: Hwang
  fullname: Hwang, S. H.
  organization: Foundry Business, Samsung Electronics Co,Yongin-City,Gyeonggi-Do,Korea,446-711
– sequence: 8
  givenname: Y.
  surname: Ji
  fullname: Ji, Y.
  organization: Foundry Business, Samsung Electronics Co,Yongin-City,Gyeonggi-Do,Korea,446-711
– sequence: 9
  givenname: K.
  surname: Lee
  fullname: Lee, K.
  organization: R&D Center, Samsung Electronics,Hwasung,Korea
– sequence: 10
  givenname: K.
  surname: Lee
  fullname: Lee, K.
  organization: Foundry Business, Samsung Electronics Co,Yongin-City,Gyeonggi-Do,Korea,446-711
– sequence: 11
  givenname: Y. J.
  surname: Song
  fullname: Song, Y. J.
  organization: R&D Center, Samsung Electronics,Hwasung,Korea
– sequence: 12
  givenname: Y. G.
  surname: Hong
  fullname: Hong, Y. G.
  organization: Foundry Business, Samsung Electronics Co,Yongin-City,Gyeonggi-Do,Korea,446-711
– sequence: 13
  givenname: G. T.
  surname: Jeong
  fullname: Jeong, G. T.
  organization: Foundry Business, Samsung Electronics Co,Yongin-City,Gyeonggi-Do,Korea,446-711
BookMark eNotj91Kw0AQRldRsKk-gSB5gcSZ7Ca7c1mKP4UWJY3XZZPZhZU0CUkU-vYW7NXHuTmHLxI3Xd85IZ4QUkSg5035uVdFnps0gwxTUpADqSsRoc4MFoakvhYLJGkSNIR3Ipqmb4AMpCkWgkrXBluHNsynuPfxvqqSXbnaxb4f4187hv5nit2xdsyOYzsMbWjsHPpuuhe33raTe7jsUny9vlTr92T78bZZr7ZJOCfmxGvyzA0jWKiZgCSzsVZrfQbk3DeIxjhyVKAGnykCpUzO3hqnFUu5FI__3uCcOwxjONrxdLjclH-h1Ujd
ContentType Conference Proceeding
DBID 6IE
6IH
CBEJK
RIE
RIO
DOI 10.1109/IRPS46558.2021.9405094
DatabaseName IEEE Electronic Library (IEL) Conference Proceedings
IEEE Proceedings Order Plan (POP) 1998-present by volume
IEEE Xplore All Conference Proceedings
IEEE Electronic Library Online
IEEE Proceedings Order Plans (POP) 1998-present
DatabaseTitleList
Database_xml – sequence: 1
  dbid: RIE
  name: IEEE Electronic Library Online
  url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/
  sourceTypes: Publisher
DeliveryMethod fulltext_linktorsrc
Discipline Engineering
EISBN 1728168937
9781728168937
EISSN 1938-1891
EndPage 5
ExternalDocumentID 9405094
Genre orig-research
GroupedDBID 29I
6IE
6IF
6IH
6IL
6IN
ABLEC
ADZIZ
AI.
ALMA_UNASSIGNED_HOLDINGS
BEFXN
BFFAM
BGNUA
BKEBE
BPEOZ
CBEJK
CHZPO
IEGSK
IJVOP
OCL
RIE
RIL
RIO
VH1
ID FETCH-LOGICAL-i203t-f79fddcd10a0bd9093dd8aa777d901d5fc1188e9e96170f24904485dfa8e74d33
IEDL.DBID RIE
IngestDate Wed Jun 26 19:26:52 EDT 2024
IsPeerReviewed false
IsScholarly true
Language English
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-i203t-f79fddcd10a0bd9093dd8aa777d901d5fc1188e9e96170f24904485dfa8e74d33
PageCount 5
ParticipantIDs ieee_primary_9405094
PublicationCentury 2000
PublicationDate 2021-March
PublicationDateYYYYMMDD 2021-03-01
PublicationDate_xml – month: 03
  year: 2021
  text: 2021-March
PublicationDecade 2020
PublicationTitle 2021 IEEE International Reliability Physics Symposium (IRPS)
PublicationTitleAbbrev IRPS46558
PublicationYear 2021
Publisher IEEE
Publisher_xml – name: IEEE
SSID ssj0020386
Score 2.2467942
Snippet Owing to tunability of MTJ stack characteristics based on perpendicular magnetic anisotropy control via sophisticated magnetic material engineering, STT-MRAM...
SourceID ieee
SourceType Publisher
StartPage 1
SubjectTerms Artificial intelligence
Flash-type
Magnetic materials
Magnetic switching
Microcontrollers
Perpendicular magnetic anisotropy
Reliability
SRAM-type
STT-MRAM
Switches
Tunalibility
Title Reliability of STT-MRAM for various embedded applications
URI https://ieeexplore.ieee.org/document/9405094
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1LSwMxEB7anvTioxXf5ODR3Sa72c3mKGKpwkrpA3oryU4CIrYiW0F_vcnuWh948JYEQpIJZOZLvvkCcCGLyGapEkEkNA24Nl4DEnmAqHjEUadZdZWd36fDGb-bJ_MWXG5yYYwxFfnMhL5YveXjqlj7q7K-5F6thLehLaSsc7U24IrGWdpkADMq-7fj0cRLg3n2VsTCpuePL1QqDzLYgfxz7Jo48hiuSx0W779kGf87uV3ofeXqkdHGC-1Byyz3YfubzGAXpOcd13rcb2RlyWQ6DfLxVU5cwEpeHVh26J-YJ23cIYTk-5N2D2aDm-n1MGi-TAgenAXKwAppEQtkVFGNksoYMVNKCOEqDBNbOECRGWmkF2K3DntRh88StCozgmMcH0BnuVqaQyAOOrmWjMbaxVyKU-UiF2YZK1iirWbpEXS9ERbPtSrGoln_8d_NJ7DlN6Jmb51Cp3xZmzPnzkt9Xu3jB--Tnnk
link.rule.ids 310,311,783,787,792,793,799,23942,23943,25152,27937,55086
linkProvider IEEE
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV3PT8MgFH6Z86Be_LEZf8vBo92gpS0cjXHZdF2WrUt2W6BAYoybMZ2J_vVCW-c0HrwBCQEeCe998L0PgCue-YZFIvb8WGKPSu00IBX1lBLUp0pGrLjKTgZRd0Lvp-G0BterXBitdUE-0y1XLN7y1SJbuquyNqdOrYRuwKaNq1lUZmut4BUOWFTlABPM273RcOzEwRx_yyetqu-PT1QKH9LZheRr9JI68tRa5rKVffwSZvzv9Pag-Z2th4YrP7QPNT0_gJ01ocEGcMc8LhW539HCoHGaesnoJkE2ZEVvFi5b_I_0s9T2GFJo_VG7CZPOXXrb9apPE7xHa4HcMzE3SmWKYIGl4pgHSjEh4ji2FaJCk1lIwTTX3EmxG4u-sEVooTKC6ZiqIDiE-nwx10eALHiyLQwH0kZdgmJhYxdiCMlIKI0k0TE0nBFmL6Uuxqxa_8nfzZew1U2T_qzfGzycwrbblJLLdQb1_HWpz61zz-VFsaefbE-hxA
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=proceeding&rft.title=2021+IEEE+International+Reliability+Physics+Symposium+%28IRPS%29&rft.atitle=Reliability+of+STT-MRAM+for+various+embedded+applications&rft.au=Han%2C+S.+H.&rft.au=Lee%2C+J.+H.&rft.au=Suh%2C+K.+S.&rft.au=Nam%2C+K.+T.&rft.date=2021-03-01&rft.pub=IEEE&rft.eissn=1938-1891&rft.spage=1&rft.epage=5&rft_id=info:doi/10.1109%2FIRPS46558.2021.9405094&rft.externalDocID=9405094