A New Type Low Cost Sandwiched Power Package Structure and its Manufacturing

Now stacked die 3D package is much popular, especially for such power 3D package. For example, sometimes it designs control die stacking on power die; (refer to below package structure design) and control die apply thinner Cu wire bonding; but power die applies thicker Al wire bonding. This looks li...

Full description

Saved in:
Bibliographic Details
Published in2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) pp. 1 - 7
Main Authors Ge, Garry, Lye, Gideon, Wang, Sonder, Zaal, Jeroen
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.12.2019
Subjects
Bonding
Delamination
Digital-analog conversion
Electronic packaging thermal management
Lead
Wires
Online AccessGet full text

Cover

More Information
Summary:Now stacked die 3D package is much popular, especially for such power 3D package. For example, sometimes it designs control die stacking on power die; (refer to below package structure design) and control die apply thinner Cu wire bonding; but power die applies thicker Al wire bonding. This looks like conventional stacked dies design.
DOI:10.1109/EPTC47984.2019.9026671