Low temperature Cu sinter joining on different metallization substrates and its reliability evaluation with a high current density - Chen, Chuantong; Iwaki, Aya; Suetake, Aiji; Sugiura, Kazuhiko; Kanie, Kiyoshi; Suganuma, Katsuaki (Proceedings of the International Symposium on Power Semiconductor Devices & ICs, 2021)
Keywords: Cu sinter joining; Current density; high power density; Materials reliability; Metallization; Multichip modules; Photonic band gap; power cycling; power modules; Power semiconductor devices; Power system measurements