Low temperature hermetically sealed, optically transparent miniature packages: from medical to space

• Published in: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) pp. 1673 - 1681
• Main Authors: James, Rony Jose, Durante, Guido Spinola, Revol, Vincent, Marozau, Ivan, Krasnopolski, Krzysztof, Fretz, Mark, Mohrdiek, Stefan
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01.06.2021
• Subjects: active implantable medical devices; Glass; glass package; Hermetic sealing; laser sealing; leak testing; low temperature; Manufacturing; Packaging; sapphire package; Seals; Silicon; Silicon carbide; Space; Temperature measurement

Low temperature hermetic sealing has been a major challenge in many microsystem development efforts. Especially when miniaturization is involved, traditional methods of hermetic sealing are not easily applicable. This paper focuses on a beyond state-of-the-art, low-temperature, laser-based hermetic...